电子电路设计中的半导体器件建模与仿真

S. Shamsir, Sakib Hasan, Omiya Hassan, P. Paul, Razuan Hossain, S. K. Islam
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引用次数: 3

摘要

本章涵盖了用于电子电路仿真的半导体器件建模的不同方法。它提出了基于物理的分析建模方法的讨论,以预测器件在特定条件下的操作,如应用偏置(例如,电压和电流);环境(如温度、噪音);和物理特性(例如,几何形状,兴奋剂水平)。然而,器件模型的制定涉及精度和计算速度之间的权衡,对于大多数实际操作,如基于spice的电路模拟器,经验建模方法通常是首选的。因此,本章还涵盖了通过实现数学拟合方程来预测设备运行的经验建模方法。此外,它还包括数值装置建模方法,其中涉及使用不同类型的商业计算机为基础的工具进行数值装置模拟。数值模型作为不同工况下设备优化的虚拟环境,其结果可用于验证其他工况下的仿真模型。
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Semiconductor Device Modeling and Simulation for Electronic Circuit Design
This chapter covers different methods of semiconductor device modeling for electronic circuit simulation. It presents a discussion on physics-based analytical modeling approach to predict device operation at specific conditions such as applied bias (e.g., voltages and currents); environment (e.g., temperature, noise); and physical characteristics (e.g., geometry, doping levels). However, formulation of device model involves trade-off between accuracy and computational speed and for most practical operation such as for SPICE-based circuit simulator, empirical modeling approach is often preferred. Thus, this chapter also covers empirical modeling approaches to predict device operation by implementing mathematically fitted equations. In addition, it includes numerical device modeling approaches, which involve numerical device simulation using different types of commercial computer-based tools. Numerical models are used as virtual environment for device optimization under different conditions and the results can be used to validate the simulation models for other operating conditions.
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