{"title":"SDWT需要工具才能成功","authors":"E. Rose, R. Odom, R. Murphy, L. Behnke","doi":"10.1109/ASMC.1995.484398","DOIUrl":null,"url":null,"abstract":"This paper will describe two Harris Semiconductor success stories and discuss the SDWT (self-directed work team) tools used to be successful. The first story concerns a union factory that, faced with the potential loss of a major customer, tried a new approach to creating dialog between teams from each company. The second story concerns a wafer fabrication line where teams were in place for two years with little signs of improvement. By introducing TOC and TPM, in combination with a structured team environment, the same group of people made significant operational improvements within six months (40% increase in volume, 2x improvement in die yield (quality), 23% reduction in cycle time, and 16% improvement in line yield).","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"SDWT requires tools to be successful\",\"authors\":\"E. Rose, R. Odom, R. Murphy, L. Behnke\",\"doi\":\"10.1109/ASMC.1995.484398\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper will describe two Harris Semiconductor success stories and discuss the SDWT (self-directed work team) tools used to be successful. The first story concerns a union factory that, faced with the potential loss of a major customer, tried a new approach to creating dialog between teams from each company. The second story concerns a wafer fabrication line where teams were in place for two years with little signs of improvement. By introducing TOC and TPM, in combination with a structured team environment, the same group of people made significant operational improvements within six months (40% increase in volume, 2x improvement in die yield (quality), 23% reduction in cycle time, and 16% improvement in line yield).\",\"PeriodicalId\":237741,\"journal\":{\"name\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1995.484398\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1995.484398","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper will describe two Harris Semiconductor success stories and discuss the SDWT (self-directed work team) tools used to be successful. The first story concerns a union factory that, faced with the potential loss of a major customer, tried a new approach to creating dialog between teams from each company. The second story concerns a wafer fabrication line where teams were in place for two years with little signs of improvement. By introducing TOC and TPM, in combination with a structured team environment, the same group of people made significant operational improvements within six months (40% increase in volume, 2x improvement in die yield (quality), 23% reduction in cycle time, and 16% improvement in line yield).