{"title":"扫描投影光刻的大面积细线图案","authors":"H. G. Muller, Yanrong Yuan, R. Sheets","doi":"10.1109/ICMCM.1994.753536","DOIUrl":null,"url":null,"abstract":"A new type of photolithography tool has been developed, addressing the specific needs of MCM manufacture. It is based on scanning projection exposure. It can expose panels at variable sizes up to 500 mm by 600 mm (typical laminate size), with an optical resolution of less than 5 gm and an overlay accuracy of 2 /spl mu/m (typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Large Area Fine Line Patterning by Scanning Projection Lithography\",\"authors\":\"H. G. Muller, Yanrong Yuan, R. Sheets\",\"doi\":\"10.1109/ICMCM.1994.753536\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new type of photolithography tool has been developed, addressing the specific needs of MCM manufacture. It is based on scanning projection exposure. It can expose panels at variable sizes up to 500 mm by 600 mm (typical laminate size), with an optical resolution of less than 5 gm and an overlay accuracy of 2 /spl mu/m (typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753536\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753536","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Large Area Fine Line Patterning by Scanning Projection Lithography
A new type of photolithography tool has been developed, addressing the specific needs of MCM manufacture. It is based on scanning projection exposure. It can expose panels at variable sizes up to 500 mm by 600 mm (typical laminate size), with an optical resolution of less than 5 gm and an overlay accuracy of 2 /spl mu/m (typical thin film design rules). With the exposure being a mask projection, mask damage and subsequent yield problems are generally avoided.
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