CMOS兼容的高电压兼容基于MESFET的模拟IC构建模块

Sungho Kim, W. Lepkowski, T. Thornton, B. Bakkaloglu
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引用次数: 0

摘要

MESFET器件提供高击穿特性,实现高压工作,并直接连接电池,而不改变最先进的SOI和SOS CMOS工艺。利用全耗尽模式MESFET器件,在单聚三层金属数字CMOS技术上设计和制造了基本模拟模块,包括单端和差分放大器以及高阻抗电流反射镜。测量到的SOS mesfet击穿电压超过7.5 V,而不会造成不可逆的损坏。直流特性是通过改变2.5到5.5V的电源来测量的。用同一过程中提取的模型模拟得到的放大器直流传递曲线与实测曲线吻合较好。电流镜在0 ~ 1.5 mA电流范围内,电源在2.5 ~ 5.5V范围内,显示反向操作的准确度在±5%以内。
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CMOS compatible high voltage compliant MESFET based analog IC building blocks
MESFET devices provide high breakdown characteristics, enable high voltage operation, and direct battery hook-up with no changes in processing on state of the art SOI and SOS CMOS processes. Fundamental analog building blocks, including single-ended and differential amplifiers and high impedance current mirror were designed and fabricated in a single poly, 3-layer metal digital CMOS technology utilizing fully depletion mode MESFET devices. The measured breakdown voltage of the SOS MESFETS presented here has a breakdown voltage of over 7.5 V without causing irreversible damage. DC characteristics were measured by varying the power supply from 2.5 to 5.5V. The measured DC transfer curves of amplifiers show good agreement with the simulated ones with extracted models from the same process. The accuracy of the current mirror showing inverse operation is within ±5% for the current from 0 to 1.5 mA with the power supply from 2.5 to 5.5V.
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