温度对AlGaN/GaN c - hemt压电压力传感器灵敏度的影响

J. Dzuba, G. Vanko, I. Ryger, M. Vallo, V. Kutǐs, T. Lalinsky
{"title":"温度对AlGaN/GaN c - hemt压电压力传感器灵敏度的影响","authors":"J. Dzuba, G. Vanko, I. Ryger, M. Vallo, V. Kutǐs, T. Lalinsky","doi":"10.1109/ASDAM.2014.6998633","DOIUrl":null,"url":null,"abstract":"We present a finite element method (FEM) analysis of the AlGaN/GaN diaphragm-based pressure sensor with integrated C-HEMT. Our concept uses the C-HEMT as a vertical ring gate capacitor to sense the changes in the piezoelectric charge generated while pressure loading. The lattice mismatch and different thermal expansion coefficients in manufacturing process put the diaphragm to the tension. The operating conditions, especially the elevated temperature, may cause the mechanical stress variations and therefore also the change in mechanical behavior of the pressure sensing diaphragm. Therefore we performed the FEM simulation to predict the influence of elevated temperature and to determine the operating temperature range of proposed circular diaphragm-based MEMS pressure sensor.","PeriodicalId":313866,"journal":{"name":"The Tenth International Conference on Advanced Semiconductor Devices and Microsystems","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Influence of temperature on the sensitivity of the AlGaN/GaN C-HEMT-based piezoelectric pressure sensor\",\"authors\":\"J. Dzuba, G. Vanko, I. Ryger, M. Vallo, V. Kutǐs, T. Lalinsky\",\"doi\":\"10.1109/ASDAM.2014.6998633\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present a finite element method (FEM) analysis of the AlGaN/GaN diaphragm-based pressure sensor with integrated C-HEMT. Our concept uses the C-HEMT as a vertical ring gate capacitor to sense the changes in the piezoelectric charge generated while pressure loading. The lattice mismatch and different thermal expansion coefficients in manufacturing process put the diaphragm to the tension. The operating conditions, especially the elevated temperature, may cause the mechanical stress variations and therefore also the change in mechanical behavior of the pressure sensing diaphragm. Therefore we performed the FEM simulation to predict the influence of elevated temperature and to determine the operating temperature range of proposed circular diaphragm-based MEMS pressure sensor.\",\"PeriodicalId\":313866,\"journal\":{\"name\":\"The Tenth International Conference on Advanced Semiconductor Devices and Microsystems\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Tenth International Conference on Advanced Semiconductor Devices and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASDAM.2014.6998633\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Tenth International Conference on Advanced Semiconductor Devices and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM.2014.6998633","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文对集成C-HEMT的AlGaN/GaN膜片压力传感器进行了有限元分析。我们的概念使用C-HEMT作为垂直环栅电容器来感知压力加载时产生的压电电荷的变化。在制造过程中,晶格失配和不同的热膨胀系数使膜片产生张力。操作条件,特别是温度升高,可能导致机械应力变化,因此也会改变压力传感隔膜的机械行为。因此,我们进行了有限元模拟来预测温度升高的影响,并确定了所提出的基于圆膜片的MEMS压力传感器的工作温度范围。
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Influence of temperature on the sensitivity of the AlGaN/GaN C-HEMT-based piezoelectric pressure sensor
We present a finite element method (FEM) analysis of the AlGaN/GaN diaphragm-based pressure sensor with integrated C-HEMT. Our concept uses the C-HEMT as a vertical ring gate capacitor to sense the changes in the piezoelectric charge generated while pressure loading. The lattice mismatch and different thermal expansion coefficients in manufacturing process put the diaphragm to the tension. The operating conditions, especially the elevated temperature, may cause the mechanical stress variations and therefore also the change in mechanical behavior of the pressure sensing diaphragm. Therefore we performed the FEM simulation to predict the influence of elevated temperature and to determine the operating temperature range of proposed circular diaphragm-based MEMS pressure sensor.
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