微机电元件摩擦的测量

K. Noguchi, H. Fujita, M. Suzuki, N. Yoshimura
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引用次数: 28

摘要

对等离子体气相沉积法、溶胶-凝胶法和真空蒸发法在玻璃基片和硅片上沉积的各种薄膜进行了最大静摩擦系数的测量和评价。静电驱动毫米级的移动装置在这些薄膜上滑动以测量摩擦系数。实验结果表明,摩擦系数与试样类型和制备方法有关。当玻璃板作为动器底部时,ZrO/sub 2/(溶胶-凝胶)膜、Al(蒸发)膜、Si(蒸发)膜、玻璃基板、硅片和SiN/sub x/ (CVD)的最大静摩擦系数都很小。在硅片上,SiO/ sub2 /(蒸发)薄膜、玻璃衬底和ZrO/ sub2 /(溶胶-凝胶)薄膜的最大静摩擦系数较小。
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The measurements of friction on micromechatronics elements
The coefficient of maximum static friction was measured and evaluated for various thin films deposited by plasma CVD (chemical vapor deposition), the sol-gel method, and vacuum evaporation on a glass substrate and a silicon wafer. Millimeter-size movers driven electrostatically slide on these films to measure friction coefficients. From the experimental results, it was found that the friction coefficients are dependent on the type of specimen and the preparation method. When the glass plate was used as the mover's bottom, the coefficients of maximum static friction for a ZrO/sub 2/ (sol-gel) film, an Al (evaporation) film, a Si (evaporation) film, a glass substrate, a silicon wafer, and a SiN/sub x/ (CVD) were found to be small. Against the silicon wafer, an SiO/sub 2/ (evaporation) film, a glass substrate, and a ZrO/sub 2/ (sol-gel) film give small coefficients of maximum static friction.<>
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Fabrication of micro-structures using non-planar lithography (NPL) In situ observation and analysis of wet etching process for micro electro-mechanical systems Silicon wafer bonding techniques for assembly of micromechanical elements Microtribology related to MEMS-Concept, measurements, applications Characteristics of an ultra-small biomotor
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