一种用于生物传感器的低成本可模式化包装技术

2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Pub Date : 2017-05-29 DOI:10.1109/DTIP.2017.7984493

A. Buchoux, E. Blair, A. Tsiamis, J. Marland, Stewart Smith

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引用次数: 1

摘要

本文介绍了一种简单、低成本的集成芯片可靠、精确封装技术。可以可靠地再现最小特征尺寸为500 μm的微通道和空腔。此外，还研究了固化深度与曝光时间的关系。制造了一个简单的微流体装置，由500 μm通道和2 mm端口组成，以演示该技术的可能性。大量的电化学实验表明，该封装材料是一种良好的绝缘体，在芯片上没有残留物。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A low cost patternable packaging technology for biosensors

This paper demonstrates a simple and low cost technology to reliably and accurately package integrated chips. Microchannels and cavities of minimum feature size of 500 μm can be reliably reproduced. In addition, the curing depth in relation to the exposure time was investigated. A simple microfluidic device, consisting of a 500 μm channel and 2 mm ports, was manufactured to demonstrate the possibilities of this technology. Extensive electrochemical experiments showed that the packaging material is a good insulator and leaves no residue on the chip.

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2017 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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