通过降低计算复杂度来表征导体表面粗糙度对CB-CPW行为的影响

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457891

Arghya Sain, K. Melde

{"title":"通过降低计算复杂度来表征导体表面粗糙度对CB-CPW行为的影响","authors":"Arghya Sain, K. Melde","doi":"10.1109/EPEPS.2012.6457891","DOIUrl":null,"url":null,"abstract":"This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity\",\"authors\":\"Arghya Sain, K. Melde\",\"doi\":\"10.1109/EPEPS.2012.6457891\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.\",\"PeriodicalId\":188377,\"journal\":{\"name\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2012.6457891\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457891","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

本文提出了一种在三维全波模拟工具中包含导体表面粗糙度影响的方法。比较了计算负荷和衰减系数随不同粗糙表面数量和面积的变化规律。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity

This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

自引率

0.00%

发文量