{"title":"慢固化非导电膜消除空隙的有效性","authors":"Lien-Kai Jao, Ming-Hung Lai, Sareddy Kr, Meng Hung Tsai, Angelo Espina, Min-Hua Chung, C.L. Gan","doi":"10.1109/EPTC56328.2022.10013292","DOIUrl":null,"url":null,"abstract":"This paper studies formation of NCF (non-conductive film) voids and verifies the effectiveness of slow-cure approach in terms of void elimination. Two collective bonding conditions were tested with one leg designed to be low in curing degree prior to the 2nd phase of collective bond where the high force is applied. The result reveals that the NCF voids form also after the 2nd phase of collective bond, indicating the NCF decomposes during bonding. The precured NCF on the other hand has better thermal resistance and turned out not forming the post-bonding voids.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"247 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effectiveness of Slow Cure Non-Conductive Film in Void elimination\",\"authors\":\"Lien-Kai Jao, Ming-Hung Lai, Sareddy Kr, Meng Hung Tsai, Angelo Espina, Min-Hua Chung, C.L. Gan\",\"doi\":\"10.1109/EPTC56328.2022.10013292\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper studies formation of NCF (non-conductive film) voids and verifies the effectiveness of slow-cure approach in terms of void elimination. Two collective bonding conditions were tested with one leg designed to be low in curing degree prior to the 2nd phase of collective bond where the high force is applied. The result reveals that the NCF voids form also after the 2nd phase of collective bond, indicating the NCF decomposes during bonding. The precured NCF on the other hand has better thermal resistance and turned out not forming the post-bonding voids.\",\"PeriodicalId\":163034,\"journal\":{\"name\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"247 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC56328.2022.10013292\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013292","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effectiveness of Slow Cure Non-Conductive Film in Void elimination
This paper studies formation of NCF (non-conductive film) voids and verifies the effectiveness of slow-cure approach in terms of void elimination. Two collective bonding conditions were tested with one leg designed to be low in curing degree prior to the 2nd phase of collective bond where the high force is applied. The result reveals that the NCF voids form also after the 2nd phase of collective bond, indicating the NCF decomposes during bonding. The precured NCF on the other hand has better thermal resistance and turned out not forming the post-bonding voids.
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