Panpan Zuo, Mengjun Wang, Hongbin Li, Tao Song, Jianying Liu
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Transmission performance of bonding wire at high frequency
Bonding wire is used to make an interconnection between ICs and the PCB board. It is small but critical in the structure. In this paper, educational 3D electromagnetic analysis software CST MWS was used to model and simulate several bonding wires with different parameters at high frequency. This paper focuses on relations between parameter changes and transmission performance of bonding wires, forming a good guide for the package design.
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