采用高密度等离子溅射沉积高稳定的顶栅顶接触ITZO TFT

J. Ahn, Kwang-Heum Lee, J. Do, W. Park, S. Park
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引用次数: 2

摘要

采用高密度等离子溅射(HDP)技术成功制备了In-Sn-Zn-O有源层的顶栅顶接触(TGTC)结构薄膜晶体管。HDP ITZO TFT的饱和迁移率为27.8cm2/Vs,阈值电压(Vth)为-0.28V。VgS = 20 V和Vds = 0.1 V的偏温应力在60℃下作用2小时,HDP ITZO TFT的Von位移为0 V,可以忽略,而通过直流溅射制备的HDP ITZO TFT的Von位移为3.1V。
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Highly stable top gate top contact ITZO TFT deposited by using high density plasma sputtering
Top gate top contact (TGTC) structured thin film transistors with In-Sn-Zn-O active layer deposited by high density plasma sputtering (HDP) have been successfully fabricated. The HDP ITZO TFT achieved saturation mobility of 27.8cm2/Vs, threshold voltage (Vth) of -0.28V The bias-temperature stress with VgS = 20 V and Vds = 0.1 V at 60°C for 2 hours yields the negligible Von shift of 0 V for the HDP ITZO TFT, while that fabricated by means of DC sputtering showed 3.1V shift.
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