基于并行技术的高效信号和功率完整性分析

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387172

Tao Su, Xiaofeng Wang, Zhengang bai, V. Vennam

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摘要

本文介绍了并行算法在电子封装和PCB板分析中的应用。已经说明了多线程在分析的各个阶段的有效性。应用分布式计算进一步加快了求解过程。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Efficient Signal and Power Integrity Analysis Using Parallel Techniques

This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB's in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.

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2007 IEEE Electrical Performance of Electronic Packaging

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