{"title":"密封盒应用中DC-DC电源模块的热性能测试和规定","authors":"A. Wojtasik","doi":"10.1109/STHERM.2008.4509374","DOIUrl":null,"url":null,"abstract":"Output power derating vs. ambient temperature and airflow is a widely used method for defining the thermal limitations of dc-dc power modules. However, this method is not suitable for sealed box applications where the modules are mainly conduction cooled by means of an external heatsink often referred to as a \"cold wall\" or \"cold plate\". In this paper a new method for testing and presentation of results for dc-dc modules in such applications is proposed.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Testing and Specifying Thermal Performance of DC-DC Power Modules used in Sealed Box Applications\",\"authors\":\"A. Wojtasik\",\"doi\":\"10.1109/STHERM.2008.4509374\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Output power derating vs. ambient temperature and airflow is a widely used method for defining the thermal limitations of dc-dc power modules. However, this method is not suitable for sealed box applications where the modules are mainly conduction cooled by means of an external heatsink often referred to as a \\\"cold wall\\\" or \\\"cold plate\\\". In this paper a new method for testing and presentation of results for dc-dc modules in such applications is proposed.\",\"PeriodicalId\":285718,\"journal\":{\"name\":\"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-03-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2008.4509374\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2008.4509374","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Testing and Specifying Thermal Performance of DC-DC Power Modules used in Sealed Box Applications
Output power derating vs. ambient temperature and airflow is a widely used method for defining the thermal limitations of dc-dc power modules. However, this method is not suitable for sealed box applications where the modules are mainly conduction cooled by means of an external heatsink often referred to as a "cold wall" or "cold plate". In this paper a new method for testing and presentation of results for dc-dc modules in such applications is proposed.
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