动态阈值电压对Ge pMOSFET迟滞的影响

A. Oliveira, P. Agopian, J. Martino, E. Simoen, C. Claeys, H. Mertens, N. Collaert, A. Thean
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引用次数: 1

摘要

本文首次对锗pmosfet在常规、动态阈值电压(DT,其中VBS= VGS)和增强动态阈值电压(eDT,其中VBS=k*VGS)模式下的工作进行了实验分析。此外,还对两种不同的HfO2/Al2O3栅层厚度进行了评价。由于动态阈值电压降低,在eDT (k = 2)模式下,与传统模式(k = 0)相比,亚阈值摆幅(SS)提高了60%。在常规模式下,最薄的Al2O3层表现出较高的漏极电流滞后,并且随着沟道长度的减小而增大。相比之下,当施加动态阈值电压时,迟滞效应从67 mV降低到4 mV以下,即几乎最小化。
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Dynamic threshold voltage influence on Ge pMOSFET hysteresis
This paper presents for the first time an experimental analysis of germanium pMOSFETs operating in conventional, dynamic threshold voltage (DT, where VBS = VGS) and enhanced dynamic threshold voltage (eDT, where VBS=k*VGS) modes. In addition, there are two different HfO2/Al2O3 gate stack thicknesses under evaluation. The subthreshold swing (SS) improves 60% in eDT (k = 2) mode compared to the conventional mode (k = 0) thanks to the dynamic threshold voltage reduction. The thinnest Al2O3 layer presents higher drain current hysteresis in the conventional mode and it increases when the channel length decreases. In contrast, the hysteresis effect reduces from 67 mV to lower than 4 mV, i.e. practically minimized when the dynamic threshold voltage is applied.
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