Accurate 3DIC thermal simulation for BEOL influence study

This present report mainly covers 2.5/3DIC system efficient and accurate thermal analysis. This report not only conducts the thermal coupling among dies, PCB, package at system level, but also performs accurate and detailed thermal analysis on specific hotspot regions. More importantly, the BEOL/RDL layer has a signicant impact on the juction temperature of the die, especially the hotspot region, which is often ignored in both industrial and academic area. Thus, the BEOL/RDL layer is incorporated into the thermal simulation by simplying the BEOL/RDL layer as the metal density. According to the simulation results, under steady-state conditions, the BEOL layer has a greater impact on the junction temperature, and under transient conditions, it has less impact on the transient temperature rise rate.