数据中心微流体冷却特性热测试包的研制

Yong Han, B. L. Lau, G. Tang, S. Lim, Xiaowu Zhang
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引用次数: 1

摘要

设计了热测试包,模拟数据中心主流处理器的热性能,进行微流体冷却特性测试。测试芯片的目标热功率为$\gt$150W,用于表征。在热测试芯片中设计了铂加热器和温度传感器。在保持各芯片总电阻不变的情况下,设计了三种曲流热线结构。为了制造热测试芯片,设计并制备了5个掩模。采用直流溅射工艺制备了铂加热器和传感器。对同一晶圆上不同位置的热测试芯片进行了测量,并对芯片中不同位置的传感器进行了测试。结果表明,加热器和传感器的平均电阻分别为300$\Omega$和1075$\Omega$,误差在±5%以内。在冷却溶液特性测试中,热测试包在高加热功率下工作良好
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Development of Thermal Test Package for Data Center Micro-Fluid Cooling Characterization
Thermal test package has been designed to mimic the thermal performance of mainstream processor used in data center for micro-fluid cooling characterization. The target heat power of the test chip is $\gt$150W for characterization. Platinum (Pt) heaters and temperature sensors have been designed in thermal test chip. Regarding meander heat line, three types of structure have been designed while maintaining same total electrical resistance in each chip. To fabricate the thermal test chip, 5 masks have been designed and prepared. Pt heaters and sensors have been fabricated simultaneously using DC sputtering process. The thermal test chips located at different positions in one wafer are measured, and the sensors located at different positions in the chips are tested as well. Results show that average resistances of heater and sensor are 300$\Omega$ and 1075$\Omega$ respectively, and errors are within ±5%. The thermal test packages work quite well at high heating power in the cooling solution characterization tests
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