使用内置去耦组件的CSP减少辐射发射

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250030

K. Nakano, T. Sudo, S. Haga

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摘要

实验验证了采用内置去耦元件的芯片封装降低辐射发射的可行性。采用内置去耦元件，基于电流波动，采用简单等效电路模型，有效地降低了辐射发射。

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Reduction in radiated emission using CSP with built-in decoupling components

Reducing radiated emission by using a chip size package with built-in decoupling components is verified experimentally. By adopting built-in decoupling components, based on the current fluctuation by the simple equivalent circuit model, valid reduction in radiated emission is recognized.

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Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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