阶跃结构RF MEMS穿孔并联开关电容建模研究

K. G. Sravani, K. Guha, K. S. Rao
{"title":"阶跃结构RF MEMS穿孔并联开关电容建模研究","authors":"K. G. Sravani, K. Guha, K. S. Rao","doi":"10.1109/EDKCON.2018.8770400","DOIUrl":null,"url":null,"abstract":"This paper presents the study of capacitance modeling of step structured non-uniform meander based capacitive RF MEMS shunt switch with etched holes on the beam. A new strategy of introducing perforation in the step structure beam minimizes the fringing field capacitance and enhances the switching speed. The switch is simulated using FEM tool for validation and the simulated results of upstate and down state capacitance is compared to the analytical results. Our outcomes reveal that proposed capacitance model defeats the existing models for satellite applications. The errors are estimated and analyzed by varying beam thickness and ligament efficiency. The proposed step structured switch having beam thickness of 1.5um with the minimal dielectric thickness results in high performance of the device with ligament efficiency of $\\mu=0.38$ comparing with the benchmark models for capacitance modelling. The proposed analytical model shows extraordinary accomplishment for higher bridge thickness of 1.5μm with an estimation of 0.2-2% error. Two bench mark models of capacitance are calculated and validated against the proposed model.","PeriodicalId":344143,"journal":{"name":"2018 IEEE Electron Devices Kolkata Conference (EDKCON)","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"An Investigation on Capacitance Modeling of Step Strcture RF MEMS Perforated Shunt Switch\",\"authors\":\"K. G. Sravani, K. Guha, K. S. Rao\",\"doi\":\"10.1109/EDKCON.2018.8770400\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the study of capacitance modeling of step structured non-uniform meander based capacitive RF MEMS shunt switch with etched holes on the beam. A new strategy of introducing perforation in the step structure beam minimizes the fringing field capacitance and enhances the switching speed. The switch is simulated using FEM tool for validation and the simulated results of upstate and down state capacitance is compared to the analytical results. Our outcomes reveal that proposed capacitance model defeats the existing models for satellite applications. The errors are estimated and analyzed by varying beam thickness and ligament efficiency. The proposed step structured switch having beam thickness of 1.5um with the minimal dielectric thickness results in high performance of the device with ligament efficiency of $\\\\mu=0.38$ comparing with the benchmark models for capacitance modelling. The proposed analytical model shows extraordinary accomplishment for higher bridge thickness of 1.5μm with an estimation of 0.2-2% error. Two bench mark models of capacitance are calculated and validated against the proposed model.\",\"PeriodicalId\":344143,\"journal\":{\"name\":\"2018 IEEE Electron Devices Kolkata Conference (EDKCON)\",\"volume\":\"2014 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Electron Devices Kolkata Conference (EDKCON)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDKCON.2018.8770400\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Electron Devices Kolkata Conference (EDKCON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDKCON.2018.8770400","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

本文研究了阶跃结构非均匀弯曲型电容式射频MEMS分流开关的电容建模。采用在阶跃结构梁中引入穿孔的新策略,减小了边缘场电容,提高了开关速度。利用有限元仿真工具对该开关进行了仿真验证,并将上、下状态电容的仿真结果与解析结果进行了比较。我们的结果表明,所提出的电容模型击败了现有的卫星应用模型。通过改变梁的厚度和韧带的效率来估计和分析误差。所提出的阶跃结构开关的光束厚度为1.5um,介质厚度最小,与电容建模的基准模型相比,该器件的韧带效率为$\mu=0.38$。该分析模型在1.5μm的桥面厚度下取得了很好的效果,估计误差在0.2 ~ 2%之间。根据所提出的模型计算并验证了电容的两个基准模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
An Investigation on Capacitance Modeling of Step Strcture RF MEMS Perforated Shunt Switch
This paper presents the study of capacitance modeling of step structured non-uniform meander based capacitive RF MEMS shunt switch with etched holes on the beam. A new strategy of introducing perforation in the step structure beam minimizes the fringing field capacitance and enhances the switching speed. The switch is simulated using FEM tool for validation and the simulated results of upstate and down state capacitance is compared to the analytical results. Our outcomes reveal that proposed capacitance model defeats the existing models for satellite applications. The errors are estimated and analyzed by varying beam thickness and ligament efficiency. The proposed step structured switch having beam thickness of 1.5um with the minimal dielectric thickness results in high performance of the device with ligament efficiency of $\mu=0.38$ comparing with the benchmark models for capacitance modelling. The proposed analytical model shows extraordinary accomplishment for higher bridge thickness of 1.5μm with an estimation of 0.2-2% error. Two bench mark models of capacitance are calculated and validated against the proposed model.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Stability Performance Comparison of a MTJ Memory Device Using Low-Dimensional HfO2, A12O3, La2O3 and h-BN as Composite Dielectric Stress Tuning in NanoScale FinFETs at 7nm Modeling Short Channel Behavior of Proposed Work Function Engineered High-k Gate Stack DG MOSFET with Vertical Gaussian Doping Study of Ag Doped SnO2 Film and its Response Towards Aromatic Compounds Present in Tea Stress Analysis in Uniaxially Strained-SiGe Channel FinFETs at 7N Technology Node
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1