C. Baudot, M. Douix, S. Guerber, S. Crémer, N. Vulliet, J. Planchot, Romuald Blanc, L. Babaud, C. Alonso‐Ramos, D. Benedikovich, D. Pérez-Galacho, S. Messaoudene, Sébastien Kerdilès, P. Acosta-Alba, C. Euvrard-Colnat, E. Cassan, D. Marris-Morini, L. Vivien, F. Boeuf
{"title":"采用传统CMOS制造方法和材料的300mm硅光子学的发展","authors":"C. Baudot, M. Douix, S. Guerber, S. Crémer, N. Vulliet, J. Planchot, Romuald Blanc, L. Babaud, C. Alonso‐Ramos, D. Benedikovich, D. Pérez-Galacho, S. Messaoudene, Sébastien Kerdilès, P. Acosta-Alba, C. Euvrard-Colnat, E. Cassan, D. Marris-Morini, L. Vivien, F. Boeuf","doi":"10.1109/IEDM.2017.8268495","DOIUrl":null,"url":null,"abstract":"Silicon photonics technological platforms are meant to generate derivative products and concurrently to benefit from the main advantages associated with CMOS platforms namely: high yield, system robustness, product reliability and large volume, low cost production. Nevertheless, a simultaneous innovative approach is to analogously take advantage from state-of-the-art fabrication methods and tools available in CMOS to develop new solutions and propose better performing devices to the platform.","PeriodicalId":412333,"journal":{"name":"2017 IEEE International Electron Devices Meeting (IEDM)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Developments in 300mm silicon photonics using traditional CMOS fabrication methods and materials\",\"authors\":\"C. Baudot, M. Douix, S. Guerber, S. Crémer, N. Vulliet, J. Planchot, Romuald Blanc, L. Babaud, C. Alonso‐Ramos, D. Benedikovich, D. Pérez-Galacho, S. Messaoudene, Sébastien Kerdilès, P. Acosta-Alba, C. Euvrard-Colnat, E. Cassan, D. Marris-Morini, L. Vivien, F. Boeuf\",\"doi\":\"10.1109/IEDM.2017.8268495\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Silicon photonics technological platforms are meant to generate derivative products and concurrently to benefit from the main advantages associated with CMOS platforms namely: high yield, system robustness, product reliability and large volume, low cost production. Nevertheless, a simultaneous innovative approach is to analogously take advantage from state-of-the-art fabrication methods and tools available in CMOS to develop new solutions and propose better performing devices to the platform.\",\"PeriodicalId\":412333,\"journal\":{\"name\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"53 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2017.8268495\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2017.8268495","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Developments in 300mm silicon photonics using traditional CMOS fabrication methods and materials
Silicon photonics technological platforms are meant to generate derivative products and concurrently to benefit from the main advantages associated with CMOS platforms namely: high yield, system robustness, product reliability and large volume, low cost production. Nevertheless, a simultaneous innovative approach is to analogously take advantage from state-of-the-art fabrication methods and tools available in CMOS to develop new solutions and propose better performing devices to the platform.