Si(111)衬底上AlGaN/GaN异质结构外延的不同缓冲方法

M. Wośko, B. Paszkiewicz, T. Szymański, R. Paszkiewicz
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引用次数: 0

摘要

采用金属有机气相沉积的方法,在2英寸Si(111)衬底上成功地生长出了2 μm无裂纹的alan /AlN/GaN异质结构层,其中有高温AlN成核层和低温AlN中间层。比较了采用梯度AlGaN和超晶格AlN/GaN缓冲层在硅衬底上沉积GaN缓冲层的方法。阻抗谱法测得AlGaN/AlN/GaN/Si(111)异质结构二维电子气的电子迁移率为2080 m2V-1s-1,而参考的AlGaN/AlN/GaN/蓝宝石异质结构的电子迁移率为2415 m2V-1s-1。
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Different buffer approaches for AlGaN/GaN heterostructures epitaxy on Si(111) substrates
A 2 μm crack-free AlGaN/AlN/GaN heterostructure stack was successfully grown on 2-inch Si(111) substrates by metal organic chemical vapor deposition with high temperature AlN nucleation layer and low temperature AlN interlayer. This approach of GaN buffer deposition on silicon substrate was compared with another ones, utilizing graded AlGaN and super lattice AlN/GaN buffers. The electron mobility of two-dimensional electron gas of AlGaN/AlN/GaN/Si(111) heterostructure measured by impedance spectroscopy was 2080 m2V-1s-1 compared to 2415 m2V-1S-1 obtained for reference AlGaN/AlN/GaN/sapphire heterostructure.
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