22nm SRAM的交叉耦合位线偏置

D. Halupka, A. Sheikholeslami
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引用次数: 4

摘要

22nm以下的工艺需要使用更大的SRAM单元,以抵消硅变化增加的影响。然而,当SRAM单元的尺寸增大时,存储密度会降低。本文提出使用交叉耦合位线(BL)偏置方案,在不过度增加SRAM单元大小的情况下,保持SRAM的快速访问速度,同时减少存在V变化时的读访问失败。通过使用22nm预测CMOS模型进行广泛的蒙特卡罗模拟,我们已经证明,与传统的BL偏压方案相比,所提出的方案减少了6.5%的电池面积。
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Cross-coupled bit-line biasing for 22-nm SRAM
Sub-22nm processes necessitate the use of larger SRAM cells in order to counter the effects of increasing silicon variation. However, storage density is reduced when the SRAM cell grows in size. This paper proposes the use of a cross-coupled bit line (BL) biasing scheme that retains SRAM's fast access speed while reducing the read-access failures in the presence of V variation, without excessively increasing the SRAM cell size. We have shown, by extensive Monte-Carlo simulations using 22-nm predictive CMOS models, that the proposed scheme reduces the cell area by 6.5% compared to the conventional BL biasing schemes also analyzed in this paper.
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