W.M. Huang, Y. Tseng, D. Monk, D. Diaz, J. Ford, S. Cheng
{"title":"便携式无线通信系统的TFSOI技术","authors":"W.M. Huang, Y. Tseng, D. Monk, D. Diaz, J. Ford, S. Cheng","doi":"10.1109/CICC.1997.606658","DOIUrl":null,"url":null,"abstract":"Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed.","PeriodicalId":111737,"journal":{"name":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"TFSOI technology for portable wireless communication systems\",\"authors\":\"W.M. Huang, Y. Tseng, D. Monk, D. Diaz, J. Ford, S. Cheng\",\"doi\":\"10.1109/CICC.1997.606658\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed.\",\"PeriodicalId\":111737,\"journal\":{\"name\":\"Proceedings of CICC 97 - Custom Integrated Circuits Conference\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-05-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of CICC 97 - Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1997.606658\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1997.606658","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
TFSOI technology for portable wireless communication systems
Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed.
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