太赫兹应用中TCAD双栅HEMT的设计

S. Zafar, A. Kashif, S. Hussain, N. Akhtar, N. Bhatti, M. Imran
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引用次数: 7

摘要

III-V型化合物半导体优异的载流子输运特性由于其优异的高频特性而对太赫兹应用具有吸引力。基于InGaAs/InAlAs的III-V hemt在高频应用中特别有前景。在本文中,我们使用Silvaco TCAD软件构建了基于InAlAs/ InGaAs的二维hemt结构。本文研究了两种提高工作频率的HEMT结构:a)传统的单栅HEMT (SGHEMT)结构和b)双栅HEMT (DGHEMT)结构。在SGHEMT器件中,研究了两种不同栅极长度(300和100nm),而DGHEMT器件设计了50nm栅极长度。在SGHEMT器件中,通过减小栅极长度,fmax从349 GHz增加到432 GHz。同样,fT从108 GHz增加到144 GHz。因此,截止频率提高了33%。为了进一步提高频率,采用DGHEMT结构,将截止频率提高到175 GHz。
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Designing of double gate HEMT in TCAD for THz applications
The terrific carrier transport properties of III-V compound semiconductors have attraction for THz applications due to outstanding high-frequency characteristics. III-V HEMTs based on InGaAs/InAlAs have emerged as particularly promising for high frequencies applications. In this paper, we present two-dimensional (2-D) HEMTs structures based on InAlAs/ InGaAs using Silvaco TCAD software. Two types of HEMT structures were focused to enhance the frequency of operation: a) conventional single gate HEMT (SGHEMT) structure, and b) double gate HEMT (DGHEMT) structure. In SGHEMT devices, two different gate lengths (300 and 100nm) were studied while DGHEMT device was designed with 50nm gate length. In SGHEMT devices, fmax is increased from 349 to 432 GHz by the reduction in gate length. Similarly, fT is increased from 108 to 144 GHz. Hence, 33% enhancement in cut-off frequency is achieved. For further enhancement in frequency, DGHEMT structure is implemented to increase the cut-off frequency upto 175 GHz.
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