T. Tiwei, H. Oprins, V. Cherman, G. van der Plas, I. De Wolf, E. Beyne, M. Baelmans
{"title":"使用3d形状聚合物冷却器的大功率器件的高效直接液体射流冲击冷却","authors":"T. Tiwei, H. Oprins, V. Cherman, G. van der Plas, I. De Wolf, E. Beyne, M. Baelmans","doi":"10.1109/IEDM.2017.8268487","DOIUrl":null,"url":null,"abstract":"A novel 3D-shaped polymer multi-jet impingement cooler based on low cost fabrication techniques is introduced for high performance applications. This paper presents the modeling study, design, fabrication, experimental characterization and benchmarking of this cooling concept, showing a very good thermal performance with low required pumping power.","PeriodicalId":412333,"journal":{"name":"2017 IEEE International Electron Devices Meeting (IEDM)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":"{\"title\":\"High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler\",\"authors\":\"T. Tiwei, H. Oprins, V. Cherman, G. van der Plas, I. De Wolf, E. Beyne, M. Baelmans\",\"doi\":\"10.1109/IEDM.2017.8268487\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel 3D-shaped polymer multi-jet impingement cooler based on low cost fabrication techniques is introduced for high performance applications. This paper presents the modeling study, design, fabrication, experimental characterization and benchmarking of this cooling concept, showing a very good thermal performance with low required pumping power.\",\"PeriodicalId\":412333,\"journal\":{\"name\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"28\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2017.8268487\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2017.8268487","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
A novel 3D-shaped polymer multi-jet impingement cooler based on low cost fabrication techniques is introduced for high performance applications. This paper presents the modeling study, design, fabrication, experimental characterization and benchmarking of this cooling concept, showing a very good thermal performance with low required pumping power.