S. Rochel, G. Steele, J. Lloyd, S. Z. Hussain, D. Overhauser
{"title":"全芯片可靠性分析","authors":"S. Rochel, G. Steele, J. Lloyd, S. Z. Hussain, D. Overhauser","doi":"10.1109/RELPHY.1998.670669","DOIUrl":null,"url":null,"abstract":"Reliability analysis has not been promoted to the full-chip realm because techniques to extract, manage, and process full-chip power grid and signal data have not been previously available. This paper introduces techniques that have been developed to permit both full-chip power grid and signal net electromigration and Joule heating analysis. Results of this analysis provide feedback to the designer to permit easy design modification to provide superior \"designed-in\" long term reliability.","PeriodicalId":196556,"journal":{"name":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":"{\"title\":\"Full-chip reliability analysis\",\"authors\":\"S. Rochel, G. Steele, J. Lloyd, S. Z. Hussain, D. Overhauser\",\"doi\":\"10.1109/RELPHY.1998.670669\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Reliability analysis has not been promoted to the full-chip realm because techniques to extract, manage, and process full-chip power grid and signal data have not been previously available. This paper introduces techniques that have been developed to permit both full-chip power grid and signal net electromigration and Joule heating analysis. Results of this analysis provide feedback to the designer to permit easy design modification to provide superior \\\"designed-in\\\" long term reliability.\",\"PeriodicalId\":196556,\"journal\":{\"name\":\"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"29\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1998.670669\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1998.670669","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability analysis has not been promoted to the full-chip realm because techniques to extract, manage, and process full-chip power grid and signal data have not been previously available. This paper introduces techniques that have been developed to permit both full-chip power grid and signal net electromigration and Joule heating analysis. Results of this analysis provide feedback to the designer to permit easy design modification to provide superior "designed-in" long term reliability.
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