{"title":"温度循环过程中LED焊点裂纹的有限元建模","authors":"W. Yuan, P. Altieri-Weimar","doi":"10.1109/EUROSIME.2015.7103105","DOIUrl":null,"url":null,"abstract":"In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.","PeriodicalId":250897,"journal":{"name":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-04-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Modeling of LED solder joint cracking during temperature cycling with Finite Element\",\"authors\":\"W. Yuan, P. Altieri-Weimar\",\"doi\":\"10.1109/EUROSIME.2015.7103105\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.\",\"PeriodicalId\":250897,\"journal\":{\"name\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-04-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUROSIME.2015.7103105\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUROSIME.2015.7103105","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Modeling of LED solder joint cracking during temperature cycling with Finite Element
In this study a new simulative and analytic method is developed to determine the failure of LED package solder joints at temperature cycling (TC). The solder joint reliability is calculated using a crack growth model, which is based on a combination of cohesive zone modeling and solder creep simulation in FE-model. The crack growth model is calibrated using shear test data after TC loading. The reliability model is validated by means of TC experimental results for three different TC conditions.
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