{"title":"毫米波应用中共面互连的性能","authors":"R. Islam, R. Henderson","doi":"10.1109/SIRF.2012.6160160","DOIUrl":null,"url":null,"abstract":"The attenuation constant of interconnects fabricated in foundry and post-CMOS processing are compared up to 110 GHz. Two dielectric materials with thicknesses less than 10 microns are deposited on a lossy silicon (Si) substrate. The interlayer dielectric (ILD) from 180 nm TSMC and benzocylobutene (BCB) are used to characterize losses measured on coplanar waveguide (CPW) and grounded CPW (GCPW) at millimeter-wave (mm-wave) frequencies. CPW lines on BCB have comparable or better loss performance compared to the foundry GCPW lines at 100 GHz.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Performance of coplanar interconnects for millimeter-wave applications\",\"authors\":\"R. Islam, R. Henderson\",\"doi\":\"10.1109/SIRF.2012.6160160\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The attenuation constant of interconnects fabricated in foundry and post-CMOS processing are compared up to 110 GHz. Two dielectric materials with thicknesses less than 10 microns are deposited on a lossy silicon (Si) substrate. The interlayer dielectric (ILD) from 180 nm TSMC and benzocylobutene (BCB) are used to characterize losses measured on coplanar waveguide (CPW) and grounded CPW (GCPW) at millimeter-wave (mm-wave) frequencies. CPW lines on BCB have comparable or better loss performance compared to the foundry GCPW lines at 100 GHz.\",\"PeriodicalId\":339730,\"journal\":{\"name\":\"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIRF.2012.6160160\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIRF.2012.6160160","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance of coplanar interconnects for millimeter-wave applications
The attenuation constant of interconnects fabricated in foundry and post-CMOS processing are compared up to 110 GHz. Two dielectric materials with thicknesses less than 10 microns are deposited on a lossy silicon (Si) substrate. The interlayer dielectric (ILD) from 180 nm TSMC and benzocylobutene (BCB) are used to characterize losses measured on coplanar waveguide (CPW) and grounded CPW (GCPW) at millimeter-wave (mm-wave) frequencies. CPW lines on BCB have comparable or better loss performance compared to the foundry GCPW lines at 100 GHz.
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