首页 > 最新文献

2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems最新文献

英文 中文
High resolution imaging of few-layer graphene by Near-Field Scanning Microwave Microscopy 近场扫描微波显微镜对少层石墨烯的高分辨率成像
T. Monti, A. di Donato, M. Farina
In this work, we describe the application of an in-house system performing simultaneously Scanning Tunneling Microscopy (STM) and wide-band Near Field Scanning Microwave Microscopy (wide-band SMM) to a few-layer graphene sample. This sample is produced by mechanical exfoliation of bulk highly oriented graphite and deposited on a substrate of conductive glass. By introducing the time-domain conversion of frequency domain data, we show that it is possible to achieve nanometric resolution.
在这项工作中,我们描述了同时执行扫描隧道显微镜(STM)和宽带近场扫描微波显微镜(宽带SMM)的内部系统对几层石墨烯样品的应用。该样品是通过机械剥离大块高取向石墨并沉积在导电玻璃基板上而生产的。通过引入频域数据的时域转换,我们证明了实现纳米分辨率是可能的。
{"title":"High resolution imaging of few-layer graphene by Near-Field Scanning Microwave Microscopy","authors":"T. Monti, A. di Donato, M. Farina","doi":"10.1109/SIRF.2012.6160156","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160156","url":null,"abstract":"In this work, we describe the application of an in-house system performing simultaneously Scanning Tunneling Microscopy (STM) and wide-band Near Field Scanning Microwave Microscopy (wide-band SMM) to a few-layer graphene sample. This sample is produced by mechanical exfoliation of bulk highly oriented graphite and deposited on a substrate of conductive glass. By introducing the time-domain conversion of frequency domain data, we show that it is possible to achieve nanometric resolution.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125782747","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
A 245 GHz CB LNA and SHM mixer in SiGe technology 采用SiGe技术的245ghz CB LNA和SHM混频器
Y. Mao, K. Schmalz, J. Borngraber, J. Scheytt
The paper presents a four stage 245 GHz LNA in an ft/fmax=280/425 GHz SiGe technology and a 4th sub harmonic 245 GHz transconductance mixer in an ft/fmax=250/300 GHz SiGe technology. The LNA takes advantage of common base (CB) topology for each stage and has 12 dB gain at 245 GHz, while exhibiting a 3 dB bandwidth of 26 GHz. It has a supply voltage of 2V and power dissipation of 28 mW. The transconductance mixer has -7 dB conversion gain at 245 GHz with an LO power of 8 dBm at 61 GHz. The mixer draws 9.8 mA at 3V. Simulation results of the receiver comprising the CB LNA and SHM mixer are given.
本文提出了一种采用ft/fmax=280/425 GHz SiGe技术的四级245 GHz LNA和一种采用ft/fmax=250/300 GHz SiGe技术的四次谐波245 GHz跨导混频器。LNA利用每级共基(CB)拓扑,在245ghz时具有12db增益,同时显示26ghz的3db带宽。电源电压为2V,功耗为28mw。跨导混频器在245 GHz时具有-7 dB转换增益,在61 GHz时具有8 dBm的LO功率。混合器在3V时吸9.8 mA。给出了由CB LNA和SHM混频器组成的接收机的仿真结果。
{"title":"A 245 GHz CB LNA and SHM mixer in SiGe technology","authors":"Y. Mao, K. Schmalz, J. Borngraber, J. Scheytt","doi":"10.1109/SIRF.2012.6160120","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160120","url":null,"abstract":"The paper presents a four stage 245 GHz LNA in an ft/fmax=280/425 GHz SiGe technology and a 4th sub harmonic 245 GHz transconductance mixer in an ft/fmax=250/300 GHz SiGe technology. The LNA takes advantage of common base (CB) topology for each stage and has 12 dB gain at 245 GHz, while exhibiting a 3 dB bandwidth of 26 GHz. It has a supply voltage of 2V and power dissipation of 28 mW. The transconductance mixer has -7 dB conversion gain at 245 GHz with an LO power of 8 dBm at 61 GHz. The mixer draws 9.8 mA at 3V. Simulation results of the receiver comprising the CB LNA and SHM mixer are given.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"253 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114546003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
A DC to 6 GHz balanced elliptic low-pass filter in CMOS 130nm technology 基于CMOS 130nm技术的DC - 6ghz平衡椭圆低通滤波器
M. Mahani, R. Abhari
A passive low-pass filter on CMOS 130nm process is presented in this paper. The filter has an elliptic transfer function to give the sharpest out of band rejection with the lowest order. The bandwidth of the filter is from DC to 6GHz which makes it applicable to wide band zero IF receiver architectures. The filter has a balanced implementation in order to be integrated with a balanced mixer and shows 18 dB insertion loss at 7.7GHz. Full-wave simulations of the layout are presented together with the measurement results and show excellent agreement.
提出了一种基于CMOS 130nm工艺的无源低通滤波器。该滤波器具有椭圆传递函数,能以最低阶提供最锐利的带外抑制。该滤波器的带宽范围从直流到6GHz,适用于宽带零中频接收机架构。该滤波器具有平衡实现,以便与平衡混频器集成,并在7.7GHz时显示18 dB插入损耗。对该布局进行了全波仿真,并与实测结果进行了比较,结果吻合良好。
{"title":"A DC to 6 GHz balanced elliptic low-pass filter in CMOS 130nm technology","authors":"M. Mahani, R. Abhari","doi":"10.1109/SIRF.2012.6160159","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160159","url":null,"abstract":"A passive low-pass filter on CMOS 130nm process is presented in this paper. The filter has an elliptic transfer function to give the sharpest out of band rejection with the lowest order. The bandwidth of the filter is from DC to 6GHz which makes it applicable to wide band zero IF receiver architectures. The filter has a balanced implementation in order to be integrated with a balanced mixer and shows 18 dB insertion loss at 7.7GHz. Full-wave simulations of the layout are presented together with the measurement results and show excellent agreement.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"307 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122122793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An X-band to Ka-band SPDT switch using 200 nm SiGe HBTs 一个x波段到ka波段的SPDT开关,使用200nm SiGe hbt
C. Poh, R. Schmid, J. Cressler, J. Papapolymerou
This paper presents the design and measured performance of an X-band to Ka-band SiGe HBT SPDT switch. The proposed SPDT switch was fabricated using a 200 nm, 150 GHz peak fT silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) BiCMOS technology. The SPDT switch design uses diode-connected SiGe HBTs in a series-shunt configuration to improve the switch bandwidth and isolation. Between 8 and 40 GHz, this SPDT switch achieves an insertion loss of less than 4.3 dB, an isolation of more than 20.3 dB, and a return loss of more than 9 dB.
本文介绍了一种x波段到ka波段SiGe HBT SPDT开关的设计和实测性能。该SPDT开关采用200 nm、150 GHz峰值fT硅锗(SiGe)异质结双极晶体管(HBT) BiCMOS技术制备。SPDT开关设计采用串联分流配置的二极管连接SiGe hbt,以提高开关带宽和隔离度。在8和40 GHz之间,该SPDT开关的插入损耗小于4.3 dB,隔离度大于20.3 dB,回波损耗大于9 dB。
{"title":"An X-band to Ka-band SPDT switch using 200 nm SiGe HBTs","authors":"C. Poh, R. Schmid, J. Cressler, J. Papapolymerou","doi":"10.1109/SIRF.2012.6160118","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160118","url":null,"abstract":"This paper presents the design and measured performance of an X-band to Ka-band SiGe HBT SPDT switch. The proposed SPDT switch was fabricated using a 200 nm, 150 GHz peak fT silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) BiCMOS technology. The SPDT switch design uses diode-connected SiGe HBTs in a series-shunt configuration to improve the switch bandwidth and isolation. Between 8 and 40 GHz, this SPDT switch achieves an insertion loss of less than 4.3 dB, an isolation of more than 20.3 dB, and a return loss of more than 9 dB.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128225324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Impact of high frequency correlated noise on SiGe HBT low noise amplifier design 高频相关噪声对SiGe HBT低噪声放大器设计的影响
Pei Shen, G. Niu, Ziyan Xu, Wanrong Zhang
This paper investigates the impact of high frequency noise correlation on SiGe HBT LNA design. With correlation, simultaneous noise and impedance match is found to continue to hold approximately. However, a larger size and hence a higher biasing current are required for noise matching. The actual noise figure (NF) of LNAs designed without considering noise correlation is also investigated. Further investigation shows that a size considerably smaller than noise matching size is more preferable, as it produces high gain, high linearity and NF only slightly higher noise figure at much smaller power consumption.
本文研究了高频噪声相关对SiGe HBT LNA设计的影响。通过相关性,发现同时噪声和阻抗匹配继续保持近似。然而,噪声匹配需要更大的尺寸和更高的偏置电流。研究了在不考虑噪声相关性的情况下设计的LNAs的实际噪声系数(NF)。进一步的研究表明,比噪声匹配尺寸小得多的尺寸是更可取的,因为它可以产生高增益,高线性度和NF,在更小的功耗下仅略高的噪声系数。
{"title":"Impact of high frequency correlated noise on SiGe HBT low noise amplifier design","authors":"Pei Shen, G. Niu, Ziyan Xu, Wanrong Zhang","doi":"10.1109/SIRF.2012.6160163","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160163","url":null,"abstract":"This paper investigates the impact of high frequency noise correlation on SiGe HBT LNA design. With correlation, simultaneous noise and impedance match is found to continue to hold approximately. However, a larger size and hence a higher biasing current are required for noise matching. The actual noise figure (NF) of LNAs designed without considering noise correlation is also investigated. Further investigation shows that a size considerably smaller than noise matching size is more preferable, as it produces high gain, high linearity and NF only slightly higher noise figure at much smaller power consumption.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121389701","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
RF behavior of undoped channel ultra-thin body with ultra-thin BOX MOSFETs 使用超薄BOX型mosfet的未掺杂沟道超薄体的射频特性
M. Arshad, M. Emam, V. Kilchystka, F. Andrieu, D. Flandre, J. Raskin
RF performance of ultra-thin body with ultra-thin buried oxide (BOX), so-called UTBB, MOSFETs with gate length down to 30 nm is presented. Current gain cut-off frequency fT and maximum oscillation frequency fmax of 160 GHz and 143 GHz, respectively, are demonstrated. Based on an accurate extraction of the small-signal equivalent circuit of UTBB MOSFET over a wide frequency range, it is revealed that ground plane (GP) implementation (i.e. highly-doped region underneath the BOX)does not increase the high frequency parasitic capacitances, and thus does not degrade the RF performance of UTBB devices.
介绍了栅极长度小于30nm的超薄体超薄埋氧化物(BOX) mosfet(简称UTBB)的射频性能。电流增益截止频率fT和最大振荡频率fmax分别为160 GHz和143 GHz。基于对UTBB MOSFET在宽频率范围内的小信号等效电路的精确提取,揭示了地平面(GP)的实现(即BOX下方的高掺杂区域)不会增加高频寄生电容,从而不会降低UTBB器件的射频性能。
{"title":"RF behavior of undoped channel ultra-thin body with ultra-thin BOX MOSFETs","authors":"M. Arshad, M. Emam, V. Kilchystka, F. Andrieu, D. Flandre, J. Raskin","doi":"10.1109/SIRF.2012.6160155","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160155","url":null,"abstract":"RF performance of ultra-thin body with ultra-thin buried oxide (BOX), so-called UTBB, MOSFETs with gate length down to 30 nm is presented. Current gain cut-off frequency fT and maximum oscillation frequency fmax of 160 GHz and 143 GHz, respectively, are demonstrated. Based on an accurate extraction of the small-signal equivalent circuit of UTBB MOSFET over a wide frequency range, it is revealed that ground plane (GP) implementation (i.e. highly-doped region underneath the BOX)does not increase the high frequency parasitic capacitances, and thus does not degrade the RF performance of UTBB devices.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"6 Suppl 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132524381","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Synthesizing artificial dielectric in CMOS with digitally controlled permittivity for Radio-on-a-chip applications 在CMOS中合成具有数字控制介电常数的人造介电体用于片上无线电应用
Mau-Chung Frank Chang
The talk will describe the principle in design and implementation of artificial dielectric with digitally controlled permittivity by using periodic metal strips and active CMOS switches under differential microwave transmission lines in deep-scaled standard CMOS process. The talk will also address its demonstrated circuit/system applications by using implemented digitally controlled artificial dielectric (DiCAD) in direct carrier signal modulation and broadband frequency synthesis for high linearity/efficiency power amplifications. We will also discuss its potentials and limitations in realizing multi-band and software defined microwave/mm-wave radios with dynamic/agile band/mode selection capabilities.
本文将介绍在深尺度标准CMOS工艺中,利用周期金属条和有源CMOS开关在差分微波传输线下设计和实现具有数字控制介电常数的人工介电介质的原理。讲座还将介绍其演示电路/系统应用,通过在直接载波信号调制和宽带频率合成中使用实现的数字控制人工电介质(DiCAD)来实现高线性/高效率功率放大。我们还将讨论其在实现具有动态/敏捷频带/模式选择能力的多波段和软件定义微波/毫米波无线电方面的潜力和局限性。
{"title":"Synthesizing artificial dielectric in CMOS with digitally controlled permittivity for Radio-on-a-chip applications","authors":"Mau-Chung Frank Chang","doi":"10.1109/SIRF.2012.6160167","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160167","url":null,"abstract":"The talk will describe the principle in design and implementation of artificial dielectric with digitally controlled permittivity by using periodic metal strips and active CMOS switches under differential microwave transmission lines in deep-scaled standard CMOS process. The talk will also address its demonstrated circuit/system applications by using implemented digitally controlled artificial dielectric (DiCAD) in direct carrier signal modulation and broadband frequency synthesis for high linearity/efficiency power amplifications. We will also discuss its potentials and limitations in realizing multi-band and software defined microwave/mm-wave radios with dynamic/agile band/mode selection capabilities.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133900983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 21-GHz self-oscillating down-converter mixer 一个21 ghz自振荡下变频混频器
F. Starzer, H. Forstner, L. Maurer, A. Stelzer
Commercially available integrated radar sensor solutions are at a hard limit of distending their thermal budget. A current-reuse topology of a combined Colpitt's voltage controlled oscillator and a Gilbert-cell based mixer aimed at radar sensor applications is presented. In addition to that frequency dividers and phase locked-loop components complete the design to take effect of PLL application. In comparison to a conventional cascaded block design with even less functionality, the circuit gains 55% in energy consumption at neglectable performance losses.
商业上可用的集成雷达传感器解决方案在扩展其热预算方面存在困难。提出了一种针对雷达传感器应用的组合Colpitt压控振荡器和基于吉尔伯特单元的混频器的电流复用拓扑结构。此外,分频器和锁相环元件完成了设计,以使锁相环应用生效。与功能更少的传统级联模块设计相比,该电路的能耗降低了55%,性能损失可以忽略不计。
{"title":"A 21-GHz self-oscillating down-converter mixer","authors":"F. Starzer, H. Forstner, L. Maurer, A. Stelzer","doi":"10.1109/SIRF.2012.6160148","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160148","url":null,"abstract":"Commercially available integrated radar sensor solutions are at a hard limit of distending their thermal budget. A current-reuse topology of a combined Colpitt's voltage controlled oscillator and a Gilbert-cell based mixer aimed at radar sensor applications is presented. In addition to that frequency dividers and phase locked-loop components complete the design to take effect of PLL application. In comparison to a conventional cascaded block design with even less functionality, the circuit gains 55% in energy consumption at neglectable performance losses.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"55 12","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131875059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A 62 GHz reflectometer for biomedical sensor readout in SiGe BiCMOS technology 用于SiGe BiCMOS技术的生物医学传感器读出的62 GHz反射计
B. Laemmle, K. Schmalz, C. Scheytt, D. Kissinger, R. Weigel
In this publication an integrated reflectometer in SiGe BiCMOS technology for sensor readout at 62 GHz is presented. The circuit includes an oscillator, a six-port reflectometer, and a dummy sensor for verification purposes. The circuit has a bandwidth of 8GHz at a center frequency of 62 GHz. It operates at 3.75V supply voltage and consumes 282 mW. The measurement principle is demonstrated and the scattering parameters of the dummy sensor are compared to measurement of a breakout circuit with a commercially available vector network analyzer. The circuit has been fabricated in a 190-GHz SiGe:C BiCMOS technology and occupies an area of 0.9 mm2.
本文介绍了一种用于62 GHz传感器读出的SiGe BiCMOS集成反射计。该电路包括一个振荡器、一个六端口反射计和一个用于验证目的的虚拟传感器。该电路的中心频率为62 GHz,带宽为8GHz。它在3.75V的供电电压下运行,消耗282兆瓦。演示了测量原理,并将虚拟传感器的散射参数与市售矢量网络分析仪对断路的测量进行了比较。该电路采用190 ghz SiGe:C BiCMOS技术制造,占地面积为0.9 mm2。
{"title":"A 62 GHz reflectometer for biomedical sensor readout in SiGe BiCMOS technology","authors":"B. Laemmle, K. Schmalz, C. Scheytt, D. Kissinger, R. Weigel","doi":"10.1109/SIRF.2012.6160125","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160125","url":null,"abstract":"In this publication an integrated reflectometer in SiGe BiCMOS technology for sensor readout at 62 GHz is presented. The circuit includes an oscillator, a six-port reflectometer, and a dummy sensor for verification purposes. The circuit has a bandwidth of 8GHz at a center frequency of 62 GHz. It operates at 3.75V supply voltage and consumes 282 mW. The measurement principle is demonstrated and the scattering parameters of the dummy sensor are compared to measurement of a breakout circuit with a commercially available vector network analyzer. The circuit has been fabricated in a 190-GHz SiGe:C BiCMOS technology and occupies an area of 0.9 mm2.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"139 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121632910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS 16.9 mw 33.7 db增益毫米波接收器前端65nm CMOS
Chun-Hsing Li, C. Kuo
This work presents a low power receiver front-end design for the 77 GHz radar application. The theoretical maximum achievable gains in the LNA and the mixer are derived by using energy conservation principle. It is shown that the maximum gain can be increased by raising the impedance ratio between stages. The impedance transformation is able to provide high passive gain without any power consumption. Moreover, the quality of the passive components plays a critical role to approach the maximum gain condition. Accordingly a low power receiver front-end is designed in 65 nm CMOS. The measured results show the highest gain of 33.7 dB at 73 GHz with 3 dB bandwidth from 67 GHz to 75 GHz. The input return loss, P1dB, IIP3, and NF at IF frequency of 8 MHz, are 16.4 dB, -32 dBm, -19 dBm, and 12.2 dB, respectively. The power consumption is only 16.9 mW from a 1 V supply. To the best of our knowledge, this work shows the highest gain while consumes the lowest power as compared to the prior works.
提出了一种适用于77 GHz雷达的低功耗接收机前端设计方案。利用能量守恒原理推导了LNA和混频器的理论最大可达增益。结果表明,提高级间阻抗比可以提高最大增益。阻抗变换能够在不消耗任何功耗的情况下提供高无源增益。此外,无源元件的质量对接近最大增益条件起着至关重要的作用。据此,设计了一个低功耗的前端接收器。测量结果表明,在73 GHz时增益最高,为33.7 dB,带宽从67 GHz到75 GHz为3 dB。中频频率为8mhz时,输入回波损耗P1dB、IIP3和NF分别为16.4 dB、-32 dBm、-19 dBm和12.2 dB。功率消耗只有16.9兆瓦从1 V电源。据我们所知,与之前的作品相比,这项工作显示了最高的增益,同时消耗了最低的功率。
{"title":"16.9-mW 33.7-dB gain mmWave receiver front-end in 65 nm CMOS","authors":"Chun-Hsing Li, C. Kuo","doi":"10.1109/SIRF.2012.6160122","DOIUrl":"https://doi.org/10.1109/SIRF.2012.6160122","url":null,"abstract":"This work presents a low power receiver front-end design for the 77 GHz radar application. The theoretical maximum achievable gains in the LNA and the mixer are derived by using energy conservation principle. It is shown that the maximum gain can be increased by raising the impedance ratio between stages. The impedance transformation is able to provide high passive gain without any power consumption. Moreover, the quality of the passive components plays a critical role to approach the maximum gain condition. Accordingly a low power receiver front-end is designed in 65 nm CMOS. The measured results show the highest gain of 33.7 dB at 73 GHz with 3 dB bandwidth from 67 GHz to 75 GHz. The input return loss, P1dB, IIP3, and NF at IF frequency of 8 MHz, are 16.4 dB, -32 dBm, -19 dBm, and 12.2 dB, respectively. The power consumption is only 16.9 mW from a 1 V supply. To the best of our knowledge, this work shows the highest gain while consumes the lowest power as compared to the prior works.","PeriodicalId":339730,"journal":{"name":"2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123018829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
期刊
2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1