{"title":"通过流变特性预测wsp的可印刷性","authors":"B. Carpenter, K. Pearsall, R. Raines","doi":"10.1109/ECTC.1994.367492","DOIUrl":null,"url":null,"abstract":"Water soluble fluxes and pastes contain a high percentage of free acids that increase the activation level and subsequently enhance solderability, but do not contain resins. A method was developed that can be used to predict the printability of a water soluble solder paste. Since a solder paste shear thins and exhibits a yield point during actual printing (paste flow) these two parameters were measured and then correlated to the resultant paste print performance on more than 40 different lots of paste. The measurement techniques used for the in-depth rheological characterization as well as the viscometers employed are discussed in detail.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Predicting printability of WSPs through rheological characterization\",\"authors\":\"B. Carpenter, K. Pearsall, R. Raines\",\"doi\":\"10.1109/ECTC.1994.367492\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Water soluble fluxes and pastes contain a high percentage of free acids that increase the activation level and subsequently enhance solderability, but do not contain resins. A method was developed that can be used to predict the printability of a water soluble solder paste. Since a solder paste shear thins and exhibits a yield point during actual printing (paste flow) these two parameters were measured and then correlated to the resultant paste print performance on more than 40 different lots of paste. The measurement techniques used for the in-depth rheological characterization as well as the viscometers employed are discussed in detail.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367492\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367492","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Predicting printability of WSPs through rheological characterization
Water soluble fluxes and pastes contain a high percentage of free acids that increase the activation level and subsequently enhance solderability, but do not contain resins. A method was developed that can be used to predict the printability of a water soluble solder paste. Since a solder paste shear thins and exhibits a yield point during actual printing (paste flow) these two parameters were measured and then correlated to the resultant paste print performance on more than 40 different lots of paste. The measurement techniques used for the in-depth rheological characterization as well as the viscometers employed are discussed in detail.<>
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