高密度多层印刷线路板堆叠通孔分层分析

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598404

Moe Nozaki, Y. Kariya, Yoshiyuki Hiroshima, Nobuo Taketomi, K. Ohashi, Kenichi Tomioka, Shunichi Kikuchi, Jack Tan

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引用次数: 0

摘要

采用统计方法研究了结构因素对高密度多层印刷线路板中堆叠通孔分层的影响。虽然降低通孔的高度或通孔堆叠的数量可以有效地防止分层，但如果不能减少这些，则可以通过增加堆叠的通孔的间距来减轻分层的风险。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Delamination Analysis of Stacked Via in High-Density Multilayer Printed Wiring Boards by FEA

The effects of structural factors on the delamination of the stacked via in high-density multilayer printed wiring boards were investigated by a statistical approach. Although reducing the height of via or the number of via stacks is effective to prevent the delamination, if these cannot be reduced, the risk of the delamination is eased by increasing the pitch of the stacked via.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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