驱动器阻抗对传输线阻抗的影响

R. E. Canright
{"title":"驱动器阻抗对传输线阻抗的影响","authors":"R. E. Canright","doi":"10.1109/ECTC.1994.367599","DOIUrl":null,"url":null,"abstract":"The principle feature of robust design for quality is parameter design: selecting the design parameters to minimize quality loss. The tolerance in interconnection characteristic impedance (Zo) can impact the cost of a printed circuit board (PCB), multichip module (MCM), or hybrid if the tolerance is too small and the cost of the interconnect has to absorb rejected parts. This paper extends a theory of controlled impedance design that is compatible with the principles of robust design for quality. Practical applications and broad implications of this theory are demonstrated. The results are pertinent to both designers and fabricators of interconnections for high speed digital systems. Designers of digital output drivers will see the effect of driver impedance upon transmission line impedance.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The impact of driver impedance upon transmission line impedance\",\"authors\":\"R. E. Canright\",\"doi\":\"10.1109/ECTC.1994.367599\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The principle feature of robust design for quality is parameter design: selecting the design parameters to minimize quality loss. The tolerance in interconnection characteristic impedance (Zo) can impact the cost of a printed circuit board (PCB), multichip module (MCM), or hybrid if the tolerance is too small and the cost of the interconnect has to absorb rejected parts. This paper extends a theory of controlled impedance design that is compatible with the principles of robust design for quality. Practical applications and broad implications of this theory are demonstrated. The results are pertinent to both designers and fabricators of interconnections for high speed digital systems. Designers of digital output drivers will see the effect of driver impedance upon transmission line impedance.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367599\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

质量稳健设计的主要特征是参数设计:选择设计参数以使质量损失最小化。如果互连特性阻抗(Zo)的公差太小,并且互连的成本必须吸收不合格部件,则会影响印刷电路板(PCB),多芯片模块(MCM)或混合电路的成本。本文扩展了一种与质量稳健设计原则相兼容的可控阻抗设计理论。论证了该理论的实际应用和广泛含义。研究结果对高速数字系统互连的设计者和制造者都有参考价值。数字输出驱动器的设计者将会看到驱动器阻抗对传输线阻抗的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
The impact of driver impedance upon transmission line impedance
The principle feature of robust design for quality is parameter design: selecting the design parameters to minimize quality loss. The tolerance in interconnection characteristic impedance (Zo) can impact the cost of a printed circuit board (PCB), multichip module (MCM), or hybrid if the tolerance is too small and the cost of the interconnect has to absorb rejected parts. This paper extends a theory of controlled impedance design that is compatible with the principles of robust design for quality. Practical applications and broad implications of this theory are demonstrated. The results are pertinent to both designers and fabricators of interconnections for high speed digital systems. Designers of digital output drivers will see the effect of driver impedance upon transmission line impedance.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Development of a tapeless lead-on-chip (LOC) package A photosensitive-BCB on laminate technology (MCM-LD) A PC program that generates a model of the parasitics for IC packages Compact planar optical devices (CPODs) by CVD technology Predicting solder joint shape by computer modeling
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1