{"title":"弥合测试速度差距:延迟可测试性设计","authors":"H. Speek, H. Kerkhoff, M. Sachdev, M. Shashaani","doi":"10.1109/ETW.2000.873771","DOIUrl":null,"url":null,"abstract":"The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, expensive testers are not always capable of testing these ICs because of their high-speed limitations. This paper focuses on a design for delay testability technique such that high-speed ICs can be tested using inexpensive, low-speed ATE. Also extensions for possible full BIST of delay faults are addressed.","PeriodicalId":255826,"journal":{"name":"Proceedings IEEE European Test Workshop","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Bridging the testing speed gap: design for delay testability\",\"authors\":\"H. Speek, H. Kerkhoff, M. Sachdev, M. Shashaani\",\"doi\":\"10.1109/ETW.2000.873771\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, expensive testers are not always capable of testing these ICs because of their high-speed limitations. This paper focuses on a design for delay testability technique such that high-speed ICs can be tested using inexpensive, low-speed ATE. Also extensions for possible full BIST of delay faults are addressed.\",\"PeriodicalId\":255826,\"journal\":{\"name\":\"Proceedings IEEE European Test Workshop\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings IEEE European Test Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ETW.2000.873771\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE European Test Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ETW.2000.873771","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Bridging the testing speed gap: design for delay testability
The economic testing of high-speed digital ICs is becoming increasingly problematic. Even advanced, expensive testers are not always capable of testing these ICs because of their high-speed limitations. This paper focuses on a design for delay testability technique such that high-speed ICs can be tested using inexpensive, low-speed ATE. Also extensions for possible full BIST of delay faults are addressed.