Mems/cmos集成与图像传感器

P. Lee, C. Anagnopoulis
{"title":"Mems/cmos集成与图像传感器","authors":"P. Lee, C. Anagnopoulis","doi":"10.1109/ASIC.1998.723042","DOIUrl":null,"url":null,"abstract":"As the Application Specific Integrated Circuit (ASIC) technology pushes towards realizing electronic system-on-a-chip, it becomes apparent that there is a need for incorporating the interface between electronics and the external physical world. These interfaces or transducers take physical parameters such as light intensity, pressure and temperature and turn them into electrical signals which can be acted on in the electronic domain of the ASIC’s. This sessions deals with 2 emerging areas of Micro-Electronical-Mechanical systems (MEMS) and image sensors where integration with CMOS ASlC are being pursued.","PeriodicalId":104431,"journal":{"name":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Mems/cmos Integration & Image Sensors\",\"authors\":\"P. Lee, C. Anagnopoulis\",\"doi\":\"10.1109/ASIC.1998.723042\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the Application Specific Integrated Circuit (ASIC) technology pushes towards realizing electronic system-on-a-chip, it becomes apparent that there is a need for incorporating the interface between electronics and the external physical world. These interfaces or transducers take physical parameters such as light intensity, pressure and temperature and turn them into electrical signals which can be acted on in the electronic domain of the ASIC’s. This sessions deals with 2 emerging areas of Micro-Electronical-Mechanical systems (MEMS) and image sensors where integration with CMOS ASlC are being pursued.\",\"PeriodicalId\":104431,\"journal\":{\"name\":\"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASIC.1998.723042\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1998.723042","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

随着专用集成电路(ASIC)技术向实现电子片上系统(system-on-a-chip)的方向发展,显然需要将电子设备与外部物理世界之间的接口结合起来。这些接口或换能器采用物理参数,如光强度,压力和温度,并将其转换为可以在ASIC的电子领域中起作用的电信号。本次会议将讨论两个新兴领域,即微电子机械系统(MEMS)和图像传感器,这些领域正在寻求与CMOS ASlC的集成。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Mems/cmos Integration & Image Sensors
As the Application Specific Integrated Circuit (ASIC) technology pushes towards realizing electronic system-on-a-chip, it becomes apparent that there is a need for incorporating the interface between electronics and the external physical world. These interfaces or transducers take physical parameters such as light intensity, pressure and temperature and turn them into electrical signals which can be acted on in the electronic domain of the ASIC’s. This sessions deals with 2 emerging areas of Micro-Electronical-Mechanical systems (MEMS) and image sensors where integration with CMOS ASlC are being pursued.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Relaxed partitioning balance constraints in top-down placement Design and test of a CMOS low-power mixed-analog/digital ASIC for radiation detector readout front ends Substrate noise in mixed signal circuits: two case studies [CMOS] 800 K gates of random logic in four months: discussion on design methodologies based on "IDEFIX" ASIC experience Methodology for process portable hard IP block creation using cell based array architecture
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1