基于混合冗余MAC单元后硅调谐的变量感知参数良率增强

Sunil Dutt, Anshu Chauhan, Sukumar Nandi, G. Trivedi
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引用次数: 0

摘要

工艺参数的变化危及参数良率,对半导体工业造成严重的成本影响。后硅调谐,如自适应体偏置(ABB)和动态电压缩放(DVS)是一种强大的技术,可以减轻工艺参数变化的影响。然而,由于工艺参数的变化随着CMOS技术的持续扩展而变得越来越严重,仅由ABB或DVS可实现的性能变得有限。在本文中,为了提高参数产量,我们将ABB和DVS集成到混合冗余乘法和累加(HR-MAC)单元中。基于PTM 32nm CMOS技术的仿真结果表明,该方法可将Fast-Fast (FF)、Fast-Slow (FS)、Slow-Fast (SF)和Slow-Slow (SS)工艺拐角的参数良率分别提高81.5%、45.3%、59.92%和89.08%。
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Variability-aware parametric yield enhancement via post-silicon tuning of hybrid redundant MAC units
Variations in process parameter jeopardize the parametric yield which imposes severe cost implication on the semiconductor industry. Post-silicon tunning, such as Adaptive Body Bias (ABB) and Dynamic Voltage Scaling (DVS) is a powerful technique that mitigates the impacts of process parameter variations. However, since process parameter variations are getting aggravated with continued CMOS technology scaling, the achievable performance by ABB or DVS alone is becoming limited. In this paper, to enhance the parametric yield, we integrate ABB and DVS for the Hybrid Redundant Multiply-and-Accumulate (HR-MAC) units. Simulation results based on the PTM 32nm CMOS technology show that the proposed approach enhances the parametric yield at Fast-Fast (FF), Fast-Slow (FS), Slow-Fast (SF) and Slow-Slow (SS) process corners by 81.5%, 45.3%, 59.92% and 89.08%, respectively.
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