{"title":"倒装芯片封装用焊料碰撞方法","authors":"G. Rinne","doi":"10.1109/ECTC.1997.606176","DOIUrl":null,"url":null,"abstract":"A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"41","resultStr":"{\"title\":\"Solder bumping methods for flip chip packaging\",\"authors\":\"G. Rinne\",\"doi\":\"10.1109/ECTC.1997.606176\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.\",\"PeriodicalId\":339633,\"journal\":{\"name\":\"1997 Proceedings 47th Electronic Components and Technology Conference\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"41\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 Proceedings 47th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1997.606176\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606176","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.
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