利用表面光电压对抗蚀剂去除过程中的表面和大块离子沉积进行被动评价

S. Brown, P. Ackmann, V. Wenner, J. Lowell, W. Ostrout, C. Willson
{"title":"利用表面光电压对抗蚀剂去除过程中的表面和大块离子沉积进行被动评价","authors":"S. Brown, P. Ackmann, V. Wenner, J. Lowell, W. Ostrout, C. Willson","doi":"10.1109/ASMC.1995.484396","DOIUrl":null,"url":null,"abstract":"In this paper we report on the application of optical surface photovoltage (SPV) to both quantify and qualify both surface and bulk effects of transition and alkaline metals deposited from photoresist in CZ P-type silicon. Using standard and specially prepared 1.2 /spl mu/ resist chemistry, we will demonstrate systematically that specific ions can affect surface charge and minority carrier lifetime. We will also show how the technique can be used for nondestructive, in-line assessment of resist-deposited contaminant metals.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Passive evaluation of surface and bulk ionic deposition from resist removal using surface photovoltage\",\"authors\":\"S. Brown, P. Ackmann, V. Wenner, J. Lowell, W. Ostrout, C. Willson\",\"doi\":\"10.1109/ASMC.1995.484396\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we report on the application of optical surface photovoltage (SPV) to both quantify and qualify both surface and bulk effects of transition and alkaline metals deposited from photoresist in CZ P-type silicon. Using standard and specially prepared 1.2 /spl mu/ resist chemistry, we will demonstrate systematically that specific ions can affect surface charge and minority carrier lifetime. We will also show how the technique can be used for nondestructive, in-line assessment of resist-deposited contaminant metals.\",\"PeriodicalId\":237741,\"journal\":{\"name\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1995.484396\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1995.484396","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文报道了光学表面光电压(SPV)在czp型硅中沉积的过渡金属和碱性金属的表面和体效应的量化和定性应用。采用标准的和专门制备的1.2 /spl μ m /抗蚀剂化学方法,系统地论证了特定离子对表面电荷和少数载流子寿命的影响。我们还将展示如何将该技术用于非破坏性,在线评估电阻沉积的污染金属。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Passive evaluation of surface and bulk ionic deposition from resist removal using surface photovoltage
In this paper we report on the application of optical surface photovoltage (SPV) to both quantify and qualify both surface and bulk effects of transition and alkaline metals deposited from photoresist in CZ P-type silicon. Using standard and specially prepared 1.2 /spl mu/ resist chemistry, we will demonstrate systematically that specific ions can affect surface charge and minority carrier lifetime. We will also show how the technique can be used for nondestructive, in-line assessment of resist-deposited contaminant metals.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Automation and statistical process control of a single wafer etcher in a manufacturing environment Equipment management system (EMS) Reconvergent specular detection of material defects on silicon Managing multi-chamber tool productivity Advanced dielectric etching with a high density plasma tool: issues and challenges in manufacturing
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1