面向物联网中大规模器件应用的面隧效应管设计指南

E. Hsieh, J. Lee, M. H. Lee, S. Chung
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摘要

本文对面隧穿TFET的设计和制造进行了深入的了解。与传统的点隧穿效应管相比,利用区域隧穿效应管可以增强其电流。本研究表明,与点tfet(控制)相比,f-TFET具有1”n量级的增强,且栅极长度越长,增强幅度越大。然而,从实验结果来看,由于陷阱辅助隧穿的优势,f-TFET的S.S.略差于对照,并且对温度有很强的依赖性。为了了解陷阱如何影响f-TFET的离子,利用电荷泵送测量来检查隧道区域的陷阱分布。结果表明,通道/源界面陷阱会降低f-TFET的性能,然而,通过仔细处理f-TFET的外延过程,这种具有表面隧道的器件在未来的物联网应用中显示出巨大的潜力。
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The guideline on designing face-tunneling FET for large-scale-device applications in IoT
A thorough understanding on how to design and to manufacture a face-tunneling TFET (f-TFET) has been provided. By taking advantage of an area-tunneling, in comparison to conventional point-tunneling FET, f-TFET can be enhanced in its current. This work shows I0„ of f-TFET with one-order magnitude I„n enhancement than that of point-TFET(control), and the longer the gate length is, the higher the becomes. However, from experimental results, S.S. of f-TFET is a little worse than that of control and shows strong dependency on temperature because of dominance of trap-assisted tunneling. To understand how traps affect Ion of f-TFET, the charge-pumping measurement is utilized to examine trap distributions in the tunneling region. The results show that the channel/source interfacial traps degrade the performance of f-TFET, however, with careful treatment of the epi-process of f-TFET, this device with face-tunneling shows great potential for future IoT applications.
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