{"title":"上转换材料介导半导体键合","authors":"N. Sano, Kosuke Nishigaya, K. Tanabe","doi":"10.1109/LTB-3D53950.2021.9598362","DOIUrl":null,"url":null,"abstract":"Semiconductor wafer bonding, mediated by upconversion materials, is proposed and demonstrated. Upconversion is a process that converts long wavelength light into short wavelength light, and is expected to be applied to a variety of optoelectronic devices. Bonding with high electrical conductivity and imparting optical properties to the interface is realized by utilizing an adhesive viscous organic matrix with embedded upcinversiion nanoparticles. The application of this method to multijunction solar cells is expected.","PeriodicalId":198318,"journal":{"name":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Upconversion Material-Mediated Semiconductor Bonding\",\"authors\":\"N. Sano, Kosuke Nishigaya, K. Tanabe\",\"doi\":\"10.1109/LTB-3D53950.2021.9598362\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Semiconductor wafer bonding, mediated by upconversion materials, is proposed and demonstrated. Upconversion is a process that converts long wavelength light into short wavelength light, and is expected to be applied to a variety of optoelectronic devices. Bonding with high electrical conductivity and imparting optical properties to the interface is realized by utilizing an adhesive viscous organic matrix with embedded upcinversiion nanoparticles. The application of this method to multijunction solar cells is expected.\",\"PeriodicalId\":198318,\"journal\":{\"name\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LTB-3D53950.2021.9598362\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LTB-3D53950.2021.9598362","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Semiconductor wafer bonding, mediated by upconversion materials, is proposed and demonstrated. Upconversion is a process that converts long wavelength light into short wavelength light, and is expected to be applied to a variety of optoelectronic devices. Bonding with high electrical conductivity and imparting optical properties to the interface is realized by utilizing an adhesive viscous organic matrix with embedded upcinversiion nanoparticles. The application of this method to multijunction solar cells is expected.
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