{"title":"C-4/BGA与其他MLC单芯片封装方案的比较","authors":"K. Puttlitz, W. Shutler","doi":"10.1109/ECTC.1994.367658","DOIUrl":null,"url":null,"abstract":"Future applications will require higher I/O counts, more densification, lower cost and greater performance. This paper demonstrates why area-array based chip-to-substrate and substrate-to-card interconnections are strategic, particularly solder bump flip chips (SBFC or C-4) and solder grid arrays (SGA) respectively. That is, SBFC are capable of high pin counts coupled with high yields, performance and reliability. Moreover, recently introduced SGA interconnections, both ball and column, provide substantial benefits over standard pin grid array (PGA) packages. Also, SGA packages possess the highest density achievable at the card level when utilized in conjunction with SBFC-mounted die.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"C-4/BGA comparison with other MLC single chip package alternatives\",\"authors\":\"K. Puttlitz, W. Shutler\",\"doi\":\"10.1109/ECTC.1994.367658\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Future applications will require higher I/O counts, more densification, lower cost and greater performance. This paper demonstrates why area-array based chip-to-substrate and substrate-to-card interconnections are strategic, particularly solder bump flip chips (SBFC or C-4) and solder grid arrays (SGA) respectively. That is, SBFC are capable of high pin counts coupled with high yields, performance and reliability. Moreover, recently introduced SGA interconnections, both ball and column, provide substantial benefits over standard pin grid array (PGA) packages. Also, SGA packages possess the highest density achievable at the card level when utilized in conjunction with SBFC-mounted die.<<ETX>>\",\"PeriodicalId\":344532,\"journal\":{\"name\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1994 Proceedings. 44th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1994.367658\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367658","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
C-4/BGA comparison with other MLC single chip package alternatives
Future applications will require higher I/O counts, more densification, lower cost and greater performance. This paper demonstrates why area-array based chip-to-substrate and substrate-to-card interconnections are strategic, particularly solder bump flip chips (SBFC or C-4) and solder grid arrays (SGA) respectively. That is, SBFC are capable of high pin counts coupled with high yields, performance and reliability. Moreover, recently introduced SGA interconnections, both ball and column, provide substantial benefits over standard pin grid array (PGA) packages. Also, SGA packages possess the highest density achievable at the card level when utilized in conjunction with SBFC-mounted die.<>
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