Automated fiber pigtailing technology

The high cost of optoelectronic (OE) devices is due mainly to the labor-intensive packaging process. Manually pigtailing such devices as single-mode laser diodes and modulators is very time consuming with poor quality control. The Photonics Program and the Engineering Research Division at LLNL are addressing several issues associated with automatically packaging OE devices. A fully automated system must include high-precision fiber alignment, fiber attachment techniques, in-situ quality control, and parts handling and feeding. This paper will present on-going work at LLNL in the areas of automated fiber alignment and fiber attachment. For the fiber alignment, we are building an automated fiber pigtailing machine (AFPM) which combines computer vision and object recognition algorithms with active feedback to perform sub-micron alignments of single-mode fibers to modulators and laser diodes. We expect to perform sub-micron alignments in less than five minutes with this technology. For fiber attachment, we are building various geometries of silicon microbenches which include onboard heaters to solder metal-coated fibers and other components in place; these designs are completely compatible with an automated process of OE packaging.<>