PD-SOI CMOS器件的SPICE紧凑建模

J. Kuo
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引用次数: 0

摘要

PD-SOI SPICE基于紧凑的BiCMOS电荷控制模型,包含二阶效应、电子和晶格温度,可用于深亚微米部分耗尽(PD) SOI CMOS器件的低压CMOS电路仿真。该PD-SOI SPICE在由42个PD SOI CMOS器件组成的SRAM中执行写访问关键路径的瞬态仿真,而不会出现由于扭结效应而在建模PD器件时经常遇到的收敛问题。
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SPICE compact modeling of PD-SOI CMOS devices
This paper presents PD-SOI SPICE, which is based on compact BiCMOS charge-control models and includes second-order effects, electron and lattice temperatures, for circuit simulation of low-voltage CMOS circuits using deep-submicron partially-depleted (PD) SOI CMOS devices. This PD-SOI SPICE performs transient simulation of the write-access critical path in an SRAM composed of 42 PD SOI CMOS devices without convergence problems, which are commonly encountered while modeling PD devices due to kink effects.
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