TriGate和FinFET在SOI上的比较仿真:评估三栅极器件的多阈值电压策略

R. Coquand, M. Jaud, O. Rozeau, A. Idrissi-Eloudrhiri, S. Martinie, F. Triozon, N. Pons, S. Barraud, S. Monfray, F. Boeuf, G. Ghibaudo, O. Faynot
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引用次数: 8

摘要

本研究强调了薄盒上三栅极SOI晶体管的性能。在三维TCAD仿真中,对TriGate和FinFET结构进行了评估,并提出了10nm技术节点的0.82nm缩放EOT。由于栅极通道控制和通过超薄BOx的反偏置的良好折衷,与finfet不同,TriGate fet可以将优异的静电性能与足够的体因子(BF)结合起来。为了充分提高效率,在TriGate上采用背偏置技术的多vt策略不需要BOx凹槽和10nm的超薄BOx。在这些条件下,当栅极长度L=15nm时,TriGate上的反向偏置可以实现×1.3 ION和/16 IOFF性能。
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Comparative simulation of TriGate and FinFET on SOI: Evaluating a multiple threshold voltage strategy on triple gate devices
This study highlights the behavior of triple gate SOI transistors on thin BOx. Simulated in 3D TCAD, TriGate and FinFET structures are evaluated with scaled EOT of 0.82nm, proposed for 10nm technology node. Due to a good compromise of channel control by the gate and back-biasing through ultra-thin BOx, TriGate FETs can combine excellent electrostatics with sufficient body-factor (BF), unlike FinFETs. To be fully efficient, a multi-Vt strategy by back-biasing technique on TriGate needs no BOx recess and ultra-thin BOx of 10nm. In these conditions and at gate length L=15nm, back-biasing on TriGate could allow ×1.3 ION and /16 IOFF performance.
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