P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri
{"title":"不同基体上镍镀层微划伤与微拉伸附着力试验的对比研究","authors":"P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri","doi":"10.1109/DTIP.2014.7056691","DOIUrl":null,"url":null,"abstract":"The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.","PeriodicalId":268119,"journal":{"name":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates\",\"authors\":\"P. Nguyen, C. Seguineau, J. Desmarres, J. Alexis, T. Masri\",\"doi\":\"10.1109/DTIP.2014.7056691\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.\",\"PeriodicalId\":268119,\"journal\":{\"name\":\"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DTIP.2014.7056691\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIP.2014.7056691","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A comparative study of microscratch and microtensile adhesion tests for nickel coatings on various substrates
The present paper first focuses on discussing application ranges for the scratch test and the microtensile test. For that purpose, both have been implemented on the same nickel coating plated on several substrates, in particular a PCB, which are expected to have different adhesion behaviors. Afterward, correlations are highlighted between these two types of adhesion tests.