外钠扩散源对MOS电路可靠性的影响

P. Hefley, J. McPherson
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引用次数: 13

摘要

数据保留研究是在暴露于外部钠扩散源(碳酸氢钠)的非挥发性设备上进行的。提出了失效时间模型,并讨论了失效动力学。在这项移动离子污染研究中,钝化涂层(PO)的完整性被确定为影响数据丢失的主要因素。即使在高浓度钠(3wt .%钠溶胶)下,在300℃下烘烤的无针孔PO单元在浮栅发生钠补偿之前也会由于固有电荷损失而失效。发现在PO中有异常的单元迅速失效,失效位的局部区域显示为圆形区域。这些失效比特的圆的半径随着时间的平方根而增长。循环生长速率的阿伦尼乌斯图得到的活化能平均值为1.8 eV。
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The impact of an external sodium diffusion source on the reliability of MOS circuitry
Data retention studies were conducted on nonvolatile devices exposed to an external sodium diffusion source (sodium bicarbonate). A time-to-failure model is presented and the kinetics of failure are discussed. In this mobile ion contamination study, the integrity of the passivation overcoat (PO) was identified as the major factor affecting data loss. Even under a heavy concentration of sodium (3 wt.% Na sol.), pinhole-free PO units baked at 300 degrees C were observed to fail due to intrinsic charge loss before sodium compensation of the floating gate occurred. Units which had anomalies in the PO were found to fail rapidly with localized regions of failing bits appearing as circular areas. These circles of failed bits were found to grow in radius with the square root of time. Arrhenius plots of the rate of circular growth yielded an average value of 1.8 eV for the activation energy.<>
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