vlsi中一种新的软误差现象:α粒子诱导源/漏极穿透效应

E. Takeda, D. Hisamoto, T. Toyabe
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引用次数: 8

摘要

利用三维器件模拟器(CADDETH)和一种新的实验方法研究了α粒子源漏渗透(ALPEN)效应。迄今为止,对粒子注入软误差的研究主要集中在dram / sram等存储结构和电路上。然而,随着有效沟道长度变得与漏斗长度相当,单个mosfet中预计会出现新的软误差。作者描述了:(1)源极和漏极之间的漏斗渗透电流;(2) ALPEN效应导致的新的软误差(0 ~ 1);(3) ALPEN效应的实验验证;(4)对VLSI规模的影响。ALPEN效应给VLSI设计带来了各种限制,如锁存、双极极的发射极到集电极短路、寄生mosfet的穿孔等。因此,ALPEN效应将成为未来尺寸低于0.5 μ m的ulsi的缩放限制的关键因素。
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A new soft-error phenomenon in VLSIs: the alpha-particle-induced source/drain penetration (ALPEN) effect
The alpha-particle source/drain penetration (ALPEN) effect is investigated using a 3-D device simulator (CADDETH) and a novel experimental method. A study of soft error due to alpha-particle injection has so far focused on such memory structures and circuits as DRAMs/SRAMs. However, a new soft error is expected to occur in single MOSFETs as the effective channel length becomes comparable to the funneling length. The authors describe: (1) the funneling penetration current between source and drain; (2) a new soft error (0 to 1) caused by the ALPEN effect; (3) experimental verification of the ALPEN effect; and (4) the impact on VLSI scaling. The ALPEN effect puts various constraints, such as the latch-up, emitter-to-collector short in bipolars, and punchthrough in parasitic MOSFETs, on VLSI design. Thus, the ALPEN effect will be a crucial factor in the scaling limits of future ULSIs with dimensions below 0.5 mu m.<>
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