原子力探测和聚焦曝光矩阵分析解决SRAM高漏电流故障

Teck Leong Wee, Handoko Linewih, Sally Chwa, P. K. Tan, A. Quah, P. T. Ng, Hnin Hnin Won, Thoungh Ma, Fransiscus Rivai
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摘要

本文演示了使用电流成像、原子力探测(AFP)和聚焦曝光矩阵(FEM)分析来确定产品中静态随机存取存储器(SRAM)阵列中高泄漏电流问题的根本原因。通过电流成像和AFP探测,在SRAM坏位单元的p沟道场效应晶体管(pet)上观察到异常的电流图像对比。进一步的物理失效分析,通过脱层和透射电子显微镜(TEM)没有发现物理相关的缺陷。这表明高泄漏路径是由生产线前端(FEOL)工艺相关问题引起的。AFP分析结果显示可能与植入物有关。对一种植入膜进行了聚焦暴露矩阵(FEM)分析,结果与SRAM泄漏有很好的相关性,这表明由于抗阻覆盖不足而导致反掺杂,从而导致新产品的掩膜评估。
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Atomic Force Probing and Focus Exposure Matrix Analysis to Resolve High Leakage Current Failure on SRAM
This paper demonstrates the use of Current Imaging, Atomic Force Probing (AFP) and Focus Exposure Matrix (FEM) analysis to identify the root cause of high leakage current issue in Static Random-Access Memory (SRAM) array in the product. Through current imaging and AFP probing, abnormal current image contrast was observed on the P-Channel Field Effect Transistor (PFET) of bad SRAM bit cells. Further physical failure analysis by delayering and Transmission Electron Microscopy (TEM) found no physical-related defect. This indicates that the high leak path is caused by front-end of line (FEOL) process-related issue. The AFP analysis results indicate a possible implant-related issue. Focus Exposure Matrix (FEM) analysis was carried out on an implant mask and the results correlate well to the SRAM leakage, which suggests counter-doping due to insufficient resist coverage that leads to a new product mask evaluation.
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