有重叠反焊盘时的过孔过渡的电气性能

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2012-10-01 DOI:10.1109/EPEPS.2012.6457852

D. Kostka, A. Scogna, Jianmin Zhang, K. Qiu, R. Brooks

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引用次数: 0

摘要

研究了多层pcb中过孔的电学性能。特别地，表征了由于重叠的反衬垫引起的共振效应，并且使用基于由反衬垫和通孔形成的腔的尺寸的解析公式来预测这种共振。制作了原型板，测量结果证实了三维电磁仿真的预测结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Electrical performance of via transitions in the presence of overlapping anti-pads

The electrical performance of vias in multilayer PCBs is investigated. In particular the resonance effect due to overlapping anti-pads is characterized and an analytical formulation based on the dimensions of the cavity formed by the anti-pads and the vias is used to predict such a resonance. A prototype board is fabricated and measured results confirm the predicted results obtained from 3D electromagnetic simulation.

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2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems

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