C. Cobianu, P. Cosmin, R. Plugaru, D. Dascalu, J. Holleman
{"title":"LPCVD条件下硅烷在500-630℃/spl℃的温度范围内发生强烈的均相分解","authors":"C. Cobianu, P. Cosmin, R. Plugaru, D. Dascalu, J. Holleman","doi":"10.1109/SMICND.1996.557355","DOIUrl":null,"url":null,"abstract":"In this paper, the transition from homogeneous to heterogeneous kinetic regime is studied in the temperature range from 500 to 630/spl deg/C in a hot wall LPCVD industrial reactor. A hyperbolic-type dependence of the threshold SiH/sub 4/ flow rate (generating a strong homogeneous reaction) as a function of total pressure (in the range of 0.4-1.3 torr) is obtained for the hot wall LPCVD tube in the whole temperature range investigated. For a SiH/sub 4/ flow rate kept constant and higher than a certain value (50 sccm), a weak dependence of the threshold partial pressure on the deposition temperature is obtained for temperatures higher than 550/spl deg/C.","PeriodicalId":266178,"journal":{"name":"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"LPCVD conditions generating an intense homogeneous decomposition of silane in the temperature range of 500-630/spl deg/C\",\"authors\":\"C. Cobianu, P. Cosmin, R. Plugaru, D. Dascalu, J. Holleman\",\"doi\":\"10.1109/SMICND.1996.557355\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the transition from homogeneous to heterogeneous kinetic regime is studied in the temperature range from 500 to 630/spl deg/C in a hot wall LPCVD industrial reactor. A hyperbolic-type dependence of the threshold SiH/sub 4/ flow rate (generating a strong homogeneous reaction) as a function of total pressure (in the range of 0.4-1.3 torr) is obtained for the hot wall LPCVD tube in the whole temperature range investigated. For a SiH/sub 4/ flow rate kept constant and higher than a certain value (50 sccm), a weak dependence of the threshold partial pressure on the deposition temperature is obtained for temperatures higher than 550/spl deg/C.\",\"PeriodicalId\":266178,\"journal\":{\"name\":\"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.1996.557355\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.1996.557355","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
LPCVD conditions generating an intense homogeneous decomposition of silane in the temperature range of 500-630/spl deg/C
In this paper, the transition from homogeneous to heterogeneous kinetic regime is studied in the temperature range from 500 to 630/spl deg/C in a hot wall LPCVD industrial reactor. A hyperbolic-type dependence of the threshold SiH/sub 4/ flow rate (generating a strong homogeneous reaction) as a function of total pressure (in the range of 0.4-1.3 torr) is obtained for the hot wall LPCVD tube in the whole temperature range investigated. For a SiH/sub 4/ flow rate kept constant and higher than a certain value (50 sccm), a weak dependence of the threshold partial pressure on the deposition temperature is obtained for temperatures higher than 550/spl deg/C.