频率对循环应力下Si3N4/SiC复合材料裂纹愈合行为的影响

Koji Takahashi, Yuuta Mizobe, K. Ando, S. Saito
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引用次数: 4

摘要

采用热压法制备Si3N4/SiC陶瓷,研究应力频率对循环应力下裂纹愈合行为的影响。预裂纹为100µm的试件在800 ~ 1200℃的温度下,在300MPa的恒定或循环弯曲应力下进行裂纹修复。研究了裂纹愈合试件的综合抗弯强度。在900℃的修复温度下,在恒应力和0.5Hz的循环应力下,预裂纹均完全愈合。然而,在5和10Hz的循环应力下,预裂缝没有完全愈合。因此,应力频率影响900℃时的裂纹愈合行为。另一方面,当愈合温度高于1000℃时,在恒应力和高达10Hz的循环应力下,预裂纹都能完全愈合。应力频率的影响与愈合温度有关。从疲劳裂纹扩展和裂纹愈合的竞争机制的角度探讨了造成这一现象的原因。
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Effects of Frequency on the Crack-Healing Behavior of Si3N4/SiC Composite under Cyclic Stress
Si3N4/SiC ceramics were hot-pressed to investigate the effect of stress frequency on the crack-healing behavior under cyclic stress. The specimens having pre-crack of 100µ m were subjected to crack-healing under constant or cyclic bending stresses of 300MPa at temperatures between 800 and 1200°C. The resultant bending strength of the crack-healed specimen was investigated. At a healing temperature of 900°C, the pre-cracks had been completely healed both under constant stress and cyclic stress of 0.5Hz. However, the pre-cracks had not completely healed under a cyclic stress of 5 and 10Hz. Thus, the stress frequency affects crack-healing behaviors at 900°C. On the other hand, when the healing temperature was higher than 1000°C, the pre-cracks were healed completely under both constant stress and cyclic stress up to 10Hz. The effects of stress frequency were dependent on the healing temperature. The reasons for this were discussed from the viewpoint of competitive mechanism of fatigue crack growth and crack-healing.
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