{"title":"毫米波天线集成系统封装的最新进展","authors":"Kexin Hu, M. Tentzeris","doi":"10.1109/imarc49196.2021.9714588","DOIUrl":null,"url":null,"abstract":"Highly integrated devices have become the focus to enable 5G wireless communication in millimeter-wave band. The antenna and RFIC need to be co-evaluated and integrated to achieve high-density and low-loss designs with good antenna performance. Antenna on Chip (AoC) and Antenna in Package (AiP) are the two main solutions to this new challenge. In this paper, some recent development in mmWave antenna packaging are reviewed, including advanced interconnect design and substrate characterization. The key techniques in fabrication like LTCC, LCP, eWLB are introduced with examples. The application of additive manufacturing technologies in packaging is also demonstrated in each section.","PeriodicalId":226787,"journal":{"name":"2021 IEEE MTT-S International Microwave and RF Conference (IMARC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Advanced Development in Packaging of Antenna-integrated Systems for Millimeter-wave Applications\",\"authors\":\"Kexin Hu, M. Tentzeris\",\"doi\":\"10.1109/imarc49196.2021.9714588\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Highly integrated devices have become the focus to enable 5G wireless communication in millimeter-wave band. The antenna and RFIC need to be co-evaluated and integrated to achieve high-density and low-loss designs with good antenna performance. Antenna on Chip (AoC) and Antenna in Package (AiP) are the two main solutions to this new challenge. In this paper, some recent development in mmWave antenna packaging are reviewed, including advanced interconnect design and substrate characterization. The key techniques in fabrication like LTCC, LCP, eWLB are introduced with examples. The application of additive manufacturing technologies in packaging is also demonstrated in each section.\",\"PeriodicalId\":226787,\"journal\":{\"name\":\"2021 IEEE MTT-S International Microwave and RF Conference (IMARC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-12-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE MTT-S International Microwave and RF Conference (IMARC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/imarc49196.2021.9714588\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE MTT-S International Microwave and RF Conference (IMARC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/imarc49196.2021.9714588","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced Development in Packaging of Antenna-integrated Systems for Millimeter-wave Applications
Highly integrated devices have become the focus to enable 5G wireless communication in millimeter-wave band. The antenna and RFIC need to be co-evaluated and integrated to achieve high-density and low-loss designs with good antenna performance. Antenna on Chip (AoC) and Antenna in Package (AiP) are the two main solutions to this new challenge. In this paper, some recent development in mmWave antenna packaging are reviewed, including advanced interconnect design and substrate characterization. The key techniques in fabrication like LTCC, LCP, eWLB are introduced with examples. The application of additive manufacturing technologies in packaging is also demonstrated in each section.
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